Handbook of Thin Film Deposition

3. Auflage 2012
ISBN: 978-1-4377-7873-1
Verlag: William Andrew Publishing

Buch, Englisch, 408 Seiten, Format (B × H): 152 mm x 229 mm, Gewicht: 690 g

The Handbook of Thin Film Deposition is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, new materials for memory applications and methods for thin film optical processes. In a major restructuring, this edition of the handbook lays the foundations with an up-to-date treatment of lithography, contamination and yield management, and reliability of thin films. The established physical and chemical deposition processes and technologies are then covered, the last section of the book being devoted to more recent technological developments such as microelectromechanical systems, photovoltaic applications, digital cameras, CCD arrays, and optical thin films.

Zielgruppe

New third edition of the popular book on deposition. Aimed at engineers, technicians, and plant personnel in the semiconductor and related industries.

Autoren/Hrsg.

Seshan, Krishna

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Technologie der Oberflächenbeschichtung

Inhaltsverzeichnis

Foreword to the Third Edition

Scaling of Devices and Thermal Scaling

PVD - Special Topics

CVD New Developments

CVD Equipment

CMP Method and Practice

Process Technology for Copper Interconnects

Optical Thin Films

Thin Films in Photovoltaics

Thin Films in Memory Applications

Index

Über Autor(innen)

Seshan, Krishna
Krishna Seshan was an Assistant Professor in Materials Science at the University of Arizona with extensive professional experience as a technologist at both IBM and Intel Corporations. Dr. Seshan passed away in 2017.