Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications, Second Editon

2. Auflage 2001
ISBN: 978-0-8155-1442-8
Verlag: CRC Press

Buch, Englisch, 658 Seiten, Format (B × H): 158 mm x 231 mm, Gewicht: 1148 g

New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues-as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

Zielgruppe

New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries.

Autoren/Hrsg.

Seshan, Krishna

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie

Inhaltsverzeichnis

Foreword: Gordon MooreRecent Changes in the Semiconductor IndustryDeposition Technologies and Applications: Introduction and OverviewSilicon Epitaxy by Chemical Vapor DepositionChemical Vapor Deposition of Silicon Dioxide FilmsMetal Organic Chemical Vapor DepositionFeature Scale ModelingThe Role of Metrology and Inspection to Semiconductor ProcessingContamination Control, Defect Detection and Yield Enhancement in Gigabit ManufacturingSputtering and Sputter DepositionLaser and Electron Beam Assisted ProcessingMolecular Beam Epitaxy: Equipment and PracticeIon Beam DepositionChemical Mechanical PolishingOrganic Dielectrics in Multilevel Metallization of Integrated CircuitsPerformance, Processing, and Lithography TrendsIndex

Über Autor(innen)

Seshan, Krishna
Krishna Seshan was an Assistant Professor in Materials Science at the University of Arizona with extensive professional experience as a technologist at both IBM and Intel Corporations. Dr. Seshan passed away in 2017.

Krishna Seshan