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Elfadel / Albasha VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence
31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16–18, 2023, Revised Extended Selected PapersErscheinungsjahr 2024Verlag: Springer International PublishingISBN: 978-3-031-70947-0Medium: eBookFormat: PDF
Kopierschutz: 1 - PDF Watermark85,59 € (inkl. MwSt.)
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Noël / Nyffenegger / Rivest Product Lifecycle Management. PLM in Transition Times: The Place of Humans and Transformative Technologies
19th IFIP WG 5.1 International Conference, PLM 2022, Grenoble, France, July 10–13, 2022, Revised Selected PapersErscheinungsjahr 2023Verlag: Springer International PublishingISBN: 978-3-031-25182-5Medium: eBookFormat: PDF
Kopierschutz: 1 - PDF Watermark149,79 € (inkl. MwSt.)
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Camarinha-Matos / Adu-Kankam / Julashokri Technological Innovation for Resilient Systems
9th IFIP WG 5.5/SOCOLNET Advanced Doctoral Conference on Computing, Electrical and Industrial Systems, DoCEIS 2018, Costa de Caparica, Portugal, May 2-4, 2018, Proceedings1. Auflage 2018Verlag: Springer International PublishingISBN: 978-3-319-78574-5Medium: eBookFormat: PDF
Kopierschutz: 1 - PDF Watermark53,49 € (inkl. MwSt.)
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Sharma / Dwivedi / Metri Transfer, Diffusion and Adoption of Next-Generation Digital Technologies
IFIP WG 8.6 International Working Conference on Transfer and Diffusion of IT, TDIT 2023, Nagpur, India, December 15–16, 2023, Proceedings, Part IIIErscheinungsjahr 2023Verlag: Springer International PublishingISBN: 978-3-031-50204-0Medium: eBookFormat: PDF
Kopierschutz: 1 - PDF Watermark117,69 € (inkl. MwSt.)
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Hansen / Hoepman / Leenes Privacy and Identity Management for Emerging Services and Technologies
8th IFIP WG 9.2, 9.5, 9.6/11.7, 11.4, 11.6 International Summer School, Nijmegen, The Netherlands, June 17-21, 2013, Revised Selected PapersErscheinungsjahr 2014Verlag: SpringerISBN: 978-3-642-55137-6Medium: eBookFormat: PDF
Kopierschutz: 1 - PDF Watermark53,49 € (inkl. MwSt.)
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