Buch, Englisch, Band 7, 167 Seiten, Paperback, Format (B × H): 195 mm x 260 mm, Gewicht: 369 g
Buch, Englisch, Band 7, 167 Seiten, Paperback, Format (B × H): 195 mm x 260 mm, Gewicht: 369 g
Reihe: Frontiers in Electronic Testing
ISBN: 978-1-4613-7798-6
Verlag: Springer US
consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain.
has also been published as a special issue of the (JETTA, Volume 10, Numbers 1 and 2).
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Fundamentals of MCM Testing and Design-for-Testability.- Die Level Testing.- Known Good Die.- Substrate Testing.- A Survey of Test Techniques for MCM Substrates.- Smart Substrate MCMs.- Electron Beam Probing—A Solution for MCM Test and Failure Analysis.- Module Level Test.- MCM Test Strategy Synthesis from Chip Test and Board Test Approaches.- Designing “Dual Personality” IEEE 1149.1 Compliant Multi-Chip Modules.- An Effective Multi-Chip BIST Scheme.- MCM Test Applications.- Design-for-Test in a Multiple Substrate Multichip Module.- A Test Methodology for High Performance MCMs.- Module Level Diagnosis.- A Formalization of the IEEE 1149.1-1990 Diagnostic Methodology as Applied to Multichip Modules.- Multichip Module Diagnosis by Product-Code Signatures.- Simulation Techniques for MCMs.- Simulation Techniques for the Manufacturing Test of MCMs.- MCM Test Economics.- Economic Analysis of Test Process Flows for Multichip Modules Using Known Good Die.