Buch, Englisch, Band 11, 202 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 1080 g
Reihe: Microsystems
Buch, Englisch, Band 11, 202 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 1080 g
Reihe: Microsystems
ISBN: 978-1-4020-7256-7
Verlag: Springer US
As the field of Microsystems expands into more disciplines and new applications such as RF-MEMS, Optical MEMS and Bio-MEMS, thermal management is becoming a critical issue in the operation of many microdevices, including microelectronic chips.
Heat Convection in Micro Ducts focuses on the fundamental physics of convective heat transfer in microscale and specific applications such as: microchannel heat sinks, micro heat pipes, microcoolers and micro capillary pumped loops.
This book will be of interest to the professional engineer and graduate student interested in learning about heat removal and temperature control in advanced integrated circuits and microelectromechanical systems.
Zielgruppe
Professional/practitioner
Autoren/Hrsg.
Fachgebiete
- Naturwissenschaften Physik Mechanik Klassische Mechanik, Newtonsche Mechanik
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Technische Thermodynamik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
- Technische Wissenschaften Energietechnik | Elektrotechnik Thermische Energieerzeugung, Wärmeübertragung
- Naturwissenschaften Physik Thermodynamik
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau
Weitere Infos & Material
1. Introduction.- 2. Fundamentals of Microscale Convective Heat Transfer.- 3. Scaling, Similarity and Dimensionless Parameters in Convective Heat Transfer.- 4. Fabrication of Thermal Microsystems.- 5. Thermometry Techniques for Microscale Heat Convection Measurements.- 6. Steady, Single-Phase Heat Convection in Micro Ducts.- 7. Steady, Forced Convection Boiling in Micro Ducts.- 8. Unsteady Convective Heat Transfer in Micro Ducts.- 9. Micro Heat Pipes.- References.
