Buch, Englisch, Band 600, 883 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 1513 g
Proceedings of 2019 10th China Academic Conference on Printing and Packaging
Buch, Englisch, Band 600, 883 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 1513 g
Reihe: Lecture Notes in Electrical Engineering
ISBN: 978-981-15-1863-8
Verlag: Springer Nature Singapore
This book includes a selection of peer-reviewed papers presented at the 10th China Academic Conference on Printing and Packaging, which was held in Xi'an, China, on November 14–17, 2019. The conference was jointly organized by the China Academy of Printing Technology, Beijing Institute of Graphic Communication, and Shaanxi University of Science and Technology. With 9 keynote talks and 118 papers on graphic communication and packaging technologies, the conference attracted more than 300 scientists.
The proceedings cover the latest findings in a broad range of areas, including color science and technology, image processing technology, digital media technology, mechanical and electronic engineering, Information Engineering and Artificial Intelligence Technology, materials and detection, digital process management technology in printing and packaging, and other technologies. As such, the book appeals to university researchers, R&D engineers and graduate students in the graphic arts, packaging, color science, image science, material science, computer science, digital media, and network technology.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Elektronik | Nachrichtentechnik Nachrichten- und Kommunikationstechnik Signalverarbeitung
- Wirtschaftswissenschaften Wirtschaftssektoren & Branchen Medien-, Informations und Kommunikationswirtschaft
- Mathematik | Informatik EDV | Informatik Informatik Bildsignalverarbeitung
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik
Weitere Infos & Material
Color Science and Technology.- Image Processing Technology.- Digital Media Technology.- Printing Technology.- Packaging Technology.- Mechanical and Electronic Engineering.- Information Engineering and AI Technology.- Printing Materials and Detection Technology.