E-Book, Englisch, 584 Seiten
Zhang / Fan Mechanics of Microelectronics
1. Auflage 2006
ISBN: 978-1-4020-4935-4
Verlag: Springer-Verlag
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)
E-Book, Englisch, 584 Seiten
ISBN: 978-1-4020-4935-4
Verlag: Springer-Verlag
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)
This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Autoren/Hrsg.
Weitere Infos & Material
1;CONTENTS;6
2;PREFACE;12
3;MICROELECTRONICS TECHNOLOGY;15
4;RELIABILITY PRACTICE;49
5;THERMAL MANAGEMENT;79
6;INTRODUCTION TO ADVANCED MECHANICS;109
7;THERMO-MECHANICS OF INTEGRATED CIRCUITS AND PACKAGES;183
8;CHARACTERIZATION AND MODELLING OF MOISTURE BEHAVIOUR;295
9;CHARACTERIZATION AND MODELLING OF SOLDER JOINT RELIABILITY;391
10;VIRTUAL THERMO-MECHANICAL PROTOTYPING;483
11;CHALLENGES AND FUTURE PERSPECTIVES;551
Chapter 7
CHARACTERIZATION AND MODELLING OF SOLDER JOINT RELIABILITY (p. 378)
R. Dudek
Fraunhofer Institute Zuverlassigkeit und Mikrointegration, Gustav-Meyer-A - llee 25, 13355
Berlin, Germany
Abstract: This chapter addresses finite-element analyses (FEA) of solder fatigue phenomena caused by low-cycle thermo-mechanical loading. To begin with, an introduction to board level solder joint fatigue, characteristic thermal loading situations, the effects of thermal mismatch and analytical lifetime estimates is provided. Subsequently, challenges to the FE-based methodologies are discussed, which are particularly related to the non-linear mechanical properties of soft solders. Material constitutive models and the implementation of time and temperature dependent behaviours of leaded and lead-free solders are described. d Fatigue-life prediction modelling focuses on the strength of materials approaches, i.e., creep strain-based relations or energy-based relations. An overview on several fatigue-life prediction models from the literature is additionally provided. The FE-based methodology is applied to board-level solder joint reliability assessments for several components. Its wide applicability is illustrated by the choice of different types of components ranging from large t ceramic surface mount to small flip-chip assemblies on different types of substrates. For some of the application cases, results of parametric studies are presented and comparisons between failure prediction and testing results are made.
Key words: Solder fatigue, Finite Element simulations, solder plasticity, solder creep, primary and secondary creep, reliability predictions, coffin manson, board level test validation.
1. INTRODUCTION
The computational design of reliable microsystems, electronic packages as well as their interconnects can minimize expensive prototype development and testing. Accordingly, finite element (FE-) modelling is widely used to perform parametric studies on the thermo-mechanical behaviour of components like e.g., silicon microstructures, plastic packages, chip size/wafer level packages, or flip chip assemblies.
From a mechanical point of view all these structures include constituents, which are subjected to different loading conditions. The theoretical analysis of stresses within these constituents induced by environmental conditions requires the characterization of loads and material properties, respectively, as well as the knowledge of the appropriate failure criteria. Figure 1 provides an overview on the characteristic tasks to be performed for those thermomechanical finite element analyses (FEA).
