Buch, Englisch, 273 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 452 g
Buch, Englisch, 273 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 452 g
Reihe: Engineering Materials and Processes
ISBN: 978-1-4471-1087-3
Verlag: Springer
- heat transfer in fusion bonding;
- modelling thermal degradation;
- consolidation mechanisms;
- crystallisation kinetics;
- processing-microstructure-property relationship;
- full-scale fusion bonding;
- fusion bonding of thermosetting composite/thermoplastic composite and metal/thermoplastic joints.
The book focuses on one practical case study using the resistance welding process. This example exposes the reader to the development of processing windows for a novel manufacturing process including the use of experimental testprogrammes and modelling strategies.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
1. Introduction.- 1.1 Advanced Thermoplastic Matrix Composites (TMPCs).- 1.2 Joining Technology for Composite Materials.- 1.3 References.- 2. The State of the Art in Fusion Bonding of Polymer Composites.- 2.1 Introduction.- 2.2 Traditional Technologies.- 2.3 Fusion Bonding Technology.- 2.4 Joining of Dissimilar Materials.- 2.5 Comparative Assessment.- 2.6 Concluding Remarks.- 2.7 References.- 3. Heat Transfer in Fusion Bonding.- 3.1 Introduction.- 3.2 Heat Generation.- 3.3 Heat Transfer.- 3.4 Modelling Thermal Degradation.- 3.5 Aspects Influencing Heat Transfer in Resistance Welding.- 3.6 Simulations of Resistance Welding.- 3.7 Concluding Remarks.- 3.8 References.- 4. Consolidation Mechanisms.- 4.1 Introduction.- 4.2 Basic Mechanisms for Fusion Bonding.- 4.3 Simulations of Consolidation for Resistance Welding.- 4.4 De-consolidation Phenomenon.- 4.5 Concluding Remarks.- 4.6 References.- 5. Crystallisation Kinetics.- 5.1 Introduction.- 5.2 Description of Crystallisation Kinetics and Crystal Melting Kinetics Models.- 5.3 A Transient Crystallinity Model for Resistance Welding.- 5.4 Simulations of the Crystallinity Level.- 5.5 Concluding Remarks.- 5.6 References.- 6. Processing-Microstructure-Property Relationship.- 6.1 Introduction.- 6.2 Experimental Techniques.- 6.3 Assessing Parent Materials Properties.- 6.4 Heat Generation and Heat Transfer.- 6.5 Determination of Processing Windows.- 6.6 Concluding Remarks.- 6.7 References.- 7. Full-scale Fusion Bonding.- 7.1 Introduction.- 7.2 Strategies for Transition to Large-scale Fusion Bonding.- 7.3 Large-scale Resistance Welding.- 7.4 Concluding Remarks.- 7.5 References.- 8. Fusion Bonding of TSMC/TPMC Joints.- 8.1 Introduction.- 8.2 Experimental.- 8.3 TP Hybrid Interlayer.- 8.4 Modelling.- 8.5 Characterisation of CF-Epoxy/CF-PEIJoints.- 8.6 Concluding Remarks.- 8.7 References.- 9. Fusion Bonding of Metal/TPMC Joints.- 9.1 Introduction.- 9.2 Experimental.- 9.3 Simulation of Resistance Welding of Aluminium/CF-PEI LS Joints.- 9.4 Characterisation of Aluminium/CF-PEI LS Joints.- 9.5 Concluding Remarks.- 9.6 References.- Appendix A. Material Properties for Simulations.- Appendix B. Parameters for Crystallisation and Crystal Melting Kinetics Models.- Appendix C. Thermal Degradation Kinetic Model.- C.I Thermal Degradation Model for CF-epoxy Composite.- C.2 Thermal Degradation Model for PEI.- C.3 Thermal Degradation Model for PEEK.- C.4 References.