Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach

Softcover Nachdruck of the original 1. Auflage 2018
ISBN: 978-3-030-09323-5
Verlag: Springer International Publishing

Buch, Englisch, 177 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 295 g

This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design.  Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively.  Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.

Zielgruppe

Professional/practitioner

Autoren/Hrsg.

Yazdani, Farhang

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Schaltungsentwurf

Inhaltsverzeichnis

Introduction.- Wirebond Physical Implementation.- Flip-Chip Physical Implementation.- Substrate Physical Implementation.- Conventional Design Flow.- Pathfinding and Co-Design.

Über Autor(innen)

Farhang Yazdani is the Founder and CEO of BroadPak Corporation. BroadPak is internationally recognized as the “key provider of innovative total solution for 2.5D/3D products”. Through his 18 years with the industry, he has served in various technical, management, and advisory positions with leading semiconductor companies worldwide. He is widely regarded as an expert in 2.5D and 3D integration technologies. He is the recipient of 2013 NIPSIA award in recognition of his contribution to the advancement and innovations in packaging technologies. He has numerous publications and IPs in the area of 2.5D/3D Packaging and Assembly, serves on various technical committees and is a frequent reviewer for IEEE Journal of Advanced Packaging. He received his undergraduate and graduate degrees in Chemical Engineering and Mechanical Engineering from the University of Washington, Seattle.