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Buch, Englisch, 481 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 744 g
Reihe: Heat and Mass Transfer
Buch, Englisch, 481 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 744 g
Reihe: Heat and Mass Transfer
ISBN: 978-3-642-09754-6
Verlag: Springer
The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Technische Thermodynamik
- Naturwissenschaften Physik Thermodynamik
- Naturwissenschaften Physik Mechanik Kontinuumsmechanik, Strömungslehre
- Technische Wissenschaften Energietechnik | Elektrotechnik Thermische Energieerzeugung, Wärmeübertragung
- Technische Wissenschaften Technik Allgemein Mess- und Automatisierungstechnik
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Strömungslehre
Weitere Infos & Material
Flow and Heat Transfer.- Cooling Systems of Electronic Devices.- Velocity Field and Pressure Drop in Single-Phase Flows.- Heat Transfer in Single-Phase Flows.- Gas–Liquid Flow.- Boiling in Micro-Channels.- Design Considerations.- Special Topics.- Capillary Flow with a Distinct Interface.- Steady and Unsteady Flow in a Heated Capillary.- Laminar Flow in a Heated Capillary with a Distinct Interface.- Onset of Flow Instability in a Heated Capillary.