Wu Printed Electronics for Smart Packaging

1. Auflage 2025
ISBN: 978-3-527-84003-8
Verlag: Wiley-VCH
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 317 Seiten, E-Book

This book provides cutting-edge information about materials, technologies and mechanisms of printed electronics, and their applications for the smart packaging.

Autoren/Hrsg.

Wu, Wei

Inhaltsverzeichnis

Chapter 1 Introduction of Printed Electronics and Smart Packaging
Chapter 2 Mechanisms and Strategies of Smart Packaging
Chapter 3 Printing Methods and Integrated Strategies
Chapter 4 Functional Inks and Substrates for Smart Packaging
Chapter 5 Printed Tracks for Smart Tags and Packaging
Chapter 6 Printed Optoelectronic Devices and Energy Suppliers for Smart Packaging
Chapter 7 Printed Sensors and Indicators
Chapter 8 Integrated Printed Electronics Systems
Chapter 9 Outlooks and Perspectives

Über Autor(innen)

Wei Wu received his Ph.D. degree in materials physics and chemistry from Wuhan University in 2011. He then joined the group of Prof. Daiwen Pang at Wuhan University (2011) and Prof. V. A. L. Roy at City University of Hong Kong (2014) as a postdoctoral fellow. Currently, he is the full professor and Head of Laboratory of Printable Functional Materials and Printed Electronics, Dean of School of Printing and Packaging, Wuhan University. He received the 15th Bi Shen Award of Printing Technology in 2019, STAM Best Paper Award in 2017 and Hong Kong Scholars Award in 2014. He has published over 100 papers, which have received over 7500 citations. His research interests include the synthesis and application of printable functional materials, printed electronics, wearable electronics and intelligent packaging.
 
Jing Liang, PhD, Laboratory of Printable Functional Materials and Printed Electronics, School of Printing and Packaging, Wuhan University in China.