E-Book, Englisch, 456 Seiten
Wilson The Circuit Designer's Companion
3. Auflage 2011
ISBN: 978-0-08-097147-6
Verlag: Elsevier Science & Techn.
Format: EPUB
Kopierschutz: 6 - ePub Watermark
E-Book, Englisch, 456 Seiten
ISBN: 978-0-08-097147-6
Verlag: Elsevier Science & Techn.
Format: EPUB
Kopierschutz: 6 - ePub Watermark
Peter Wilson is Professor of Electronic Systems Engineering in the Electronic and Electrical Engineering Department at the University of Bath. After obtaining degrees at Heriot-Watt University in Edinburgh he worked as a Senior Design Engineer with Ferranti, Scotland and then as a Technical Specialist for Analogy, Inc. in Oregon, USA. After obtaining his PhD at the University of Southampton, he joined the faculty and was a member of the Academic staff at the University of Southampton from 2002 till 2015 when he moved to the University of Bath. He has published more than 100 papers and 3 books. Peter Wilson is also a Fellow of the IET, Fellow of the British Computer Society, a Chartered Engineer in the UK and a Senior Member of the IEEE.
Autoren/Hrsg.
Weitere Infos & Material
1;Front Cover;1
2;The Circuit Designer’s Companion;4
3;Copyright;5
4;Contents;6
5;Introduction;14
5.1;INTRODUCTION TO THE FIRST EDITION (TIM WILLIAMS, 1990);14
5.2;INTRODUCTION TO THE SECOND EDITION (TIM WILLIAMS, 2004);15
5.3;INTRODUCTION TO THE THIRD EDITION (PETER WILSON, 2012);16
6;CHAPTER 1 - Grounding and wiring;18
6.1;1.1 GROUNDING;19
6.2;1.2 WIRING AND CABLES;39
6.3;1.3 TRANSMISSION LINES;50
7;CHAPTER 2 - Printed circuits;62
7.1;2.1 BOARD TYPES;64
7.2;2.2 DESIGN RULES;72
7.3;2.3 BOARD ASSEMBLY: SURFACE MOUNT AND THROUGH HOLE;85
7.4;2.4 SURFACE PROTECTION;95
7.5;2.5 SOURCING BOARDS AND ARTWORK;99
8;CHAPTER 3 - Passive components;102
8.1;3.1 RESISTORS;104
8.2;3.2 POTENTIOMETERS;119
8.3;3.3 CAPACITORS;124
8.4;3.4 INDUCTORS;140
8.5;3.5 CRYSTALS AND RESONATORS;155
9;CHAPTER 4 - Active components;162
9.1;4.1 DIODES;164
9.2;4.2 THYRISTORS AND TRIACS;176
9.3;4.3 BIPOLAR TRANSISTORS;182
9.4;4.4 JUNCTION FIELD EFFECT TRANSISTORS;189
9.5;4.5 MOSFETs;195
9.6;4.6 IGBTs;201
10;CHAPTER 5 - Analog integrated circuits;206
10.1;5.1 THE IDEAL OP-208
10.2;5.2 THE PRACTICAL OP-209
10.3;5.3 COMPARATORS;239
10.4;5.4 VOLTAGE REFERENCES;247
10.5;5.5 CIRCUIT MODELING;250
11;CHAPTER 6 - Digital circuits;252
11.1;6.1 LOGIC ICS;254
11.2;6.2 INTERFACING;263
11.3;6.3 USING MICROCONTROLLERS;279
11.4;6.4 MICROPROCESSOR WATCHDOGS AND SUPERVISION;286
11.5;6.5 SOFTWARE PROTECTION TECHNIQUES;294
11.6;6.6 CHOICE OF HARDWARE PLATFORM;297
11.7;6.7 PROGRAMMABLE LOGIC DEVICES;298
11.8;6.8 FIELD PROGRAMMABLE GATE ARRAYS;298
11.9;6.9 ANALOG-TO-DIGITAL CONVERSION;298
11.10;6.10 DIFFERENT TYPES OF ANALOG-TO-DIGITAL CONVERTER;305
12;CHAPTER 7 - Power supplies;310
12.1;7.1 GENERAL;312
12.2;7.2 INPUT AND OUTPUT PARAMETERS;314
12.3;7.3 ABNORMAL CONDITIONS;330
12.4;7.4 MECHANICAL REQUIREMENTS;336
12.5;7.5 BATTERIES;338
12.6;7.6 ADVANCED CIRCUIT PROTECTION;348
13;CHAPTER 8 - Electromagnetic compatibility;350
13.1;8.1 THE NEED FOR EMC;351
13.2;8.2 EMC LEGISLATION AND STANDARDS;357
13.3;8.3 INTERFERENCE COUPLING MECHANISMS;361
13.4;8.4 CIRCUIT DESIGN AND LAYOUT;364
13.5;8.5 SHIELDING;367
13.6;8.6 FILTERING;372
13.7;8.7 CABLES AND CONNECTORS;379
13.8;8.8 EMC DESIGN CHECKLIST;381
14;CHAPTER 9 - General product design;384
14.1;9.1 SAFETY;385
14.2;9.2 DESIGN FOR PRODUCTION;390
14.3;9.3 TESTABILITY;394
14.4;9.4 RELIABILITY;400
14.5;9.5 THERMAL MANAGEMENT;407
15;Appendix: Standards;420
15.1;British standards;420
15.2;IEC standards;422
15.3;IEEE standards;422
16;Bibliography;426
17;Index;430




