E-Book, Englisch, 310 Seiten, Web PDF
Williams The Circuit Designer's Companion
1. Auflage 2013
ISBN: 978-1-4831-0250-4
Verlag: Elsevier Science & Techn.
Format: PDF
Kopierschutz: 1 - PDF Watermark
E-Book, Englisch, 310 Seiten, Web PDF
ISBN: 978-1-4831-0250-4
Verlag: Elsevier Science & Techn.
Format: PDF
Kopierschutz: 1 - PDF Watermark
The Circuit Designer's Companion covers the theoretical aspects and practices in analogue and digital circuit design. Electronic circuit design involves designing a circuit that will fulfill its specified function and designing the same circuit so that every production model of it will fulfill its specified function, and no other undesired and unspecified function. This book is composed of nine chapters and starts with a review of the concept of grounding, wiring, and printed circuits. The subsequent chapters deal with the passive and active components of circuitry design. These topics are followed by discussions of the principles of other design components, including linear integrated circuits, digital circuits, and power supplies. The remaining chapters consider the vital role of electromagnetic compatibility in circuit design. These chapters also look into safety, design of production, testability, reliability, and thermal management of the designed circuit. This book is of great value to electrical and design engineers.
Tim Williams worked for a variety of companies as an electronic design engineer, before startinghis own consultancy specializing in EMC design and test advice and training. He has monitored the progress of the EMC Directive and its associated standards since it was first made public, over the last 25 years.
Autoren/Hrsg.
Weitere Infos & Material
1;Front Cover;1
2;The Circuit Designer's Companion;4
3;Copyright Page;5
4;Table of Contents;6
5;Introduction;12
6;Chapter 1. Grounding and wiring;14
6.1;Grounding;14
6.2;Wiring and cables;31
6.3;Transmission lines;41
7;Chapter 2. Printed Circuits;49
7.1;Board types;49
7.2;Design rules;53
7.3;Surface protection;63
7.4;Surface mount;67
7.5;Sourcing boards and artwork;71
8;Chapter 3. Passive Components;74
8.1;Resistors;74
8.2;Potentiometers;81
8.3;Capacitors;85
8.4;Inductors;98
8.5;Crystals;106
9;Chapter 4. Active Components;110
9.1;Diodes;110
9.2;Thyristors and triacs;121
9.3;Bipolar transistors;127
9.4;Junction Field Effect transistors;134
9.5;MOSFETs;139
10;Chapter 5. Linear integrated circuits;146
10.1;The ideal op-146
10.2;The practical op-147
10.3;Comparators;168
10.4;Voltage references;175
11;Chapter 6. Digital Circuits;179
11.1;Logic ICs;179
11.2;Interfacing;189
11.3;Microprocessor watchdogs and supervision;200
11.4;Software techniques;207
12;Chapter 7. Power supplies;211
12.1;General;211
12.2;Input and output parameters;213
12.3;Abnormal conditions;228
12.4;Mechanical requirements;234
12.5;Batteries;236
13;Chapter 8. Electromagnetic Compatibility;243
13.1;The need for EMC;243
13.2;EMC legislation and standards;248
13.3;Interference coupling mechanisms;253
13.4;Circuit design and layout;256
13.5;Shielding;259
13.6;Filtering;263
13.7;Cables and connectors;270
13.8;EMC design checklist;272
14;Chapter 9. General product design;273
14.1;Safety;273
14.2;Design for Production;277
14.3;Testability;280
14.4;Reliability;284
14.5;Thermal management;291
15;Appendix: Standards;300
16;Bibliography;303
17;Index;306