Buch, Englisch, Band 2, 342 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 546 g
Buch, Englisch, Band 2, 342 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 546 g
Reihe: Springer Series in Advanced Microelectronics
ISBN: 978-3-642-08547-5
Verlag: Springer
Strongly involved with SIEMENS Corp. in the tremendous recent developments of process technologies for IC fabrication the authors comprehensively record their authoritative knowledge and practical experience. New materials, modern planar technology, process designs for CMOS, Bipolar, BICMOS and smart-power technologies, self-adjusting doping techniques are just a few of the highlights. With its strong application-orientation this is a need-to-have book for professionals in semiconductor industries. Senior students in electrical engineering and physics can use it as a textbook because of the systematic treatment of the subjects. With regard to their later careers as industrial engineers they will particularly appreciate the deep insight into the actual methods and problems of IC manufacturing.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
- Wirtschaftswissenschaften Wirtschaftssektoren & Branchen Fertigungsindustrie Spitzentechnologiesektor
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
Weitere Infos & Material
1 Introduction.- 2 Basic principles of integrated circuits technology.- 3 Film technology.- 4 Lithography.- 5 Etching technology.- 6 Doping technology.- 7 Cleaning technology.- 8 Process integration.- References.
