Buch, Englisch, 182 Seiten, Format (B × H): 161 mm x 243 mm, Gewicht: 440 g
Buch, Englisch, 182 Seiten, Format (B × H): 161 mm x 243 mm, Gewicht: 440 g
Reihe: Integrated Circuits and Systems
ISBN: 978-0-387-25762-4
Verlag: Springer Us
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime.
This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Zielgruppe
VLSI community for an overview of power and thermal management in integrated circuits, practicing engineers for realizing robust designs
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Technik Allgemein Konstruktionslehre und -technik
- Technische Wissenschaften Technik Allgemein Computeranwendungen in der Technik
- Mathematik | Informatik EDV | Informatik Professionelle Anwendung Computer-Aided Design (CAD)
- Geisteswissenschaften Design Produktdesign, Industriedesign
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
- Mathematik | Informatik EDV | Informatik Angewandte Informatik Computeranwendungen in Wissenschaft & Technologie
Weitere Infos & Material
Power, Junction Temperature, and Reliability.- Burn-in as a Reliability Screening Test.- Thermal and Electrothermal Modeling.- Thermal Runaway and Thermal Management.- Low Temperature CMOS Operation.
