Hybrid Genetic Optimization for IC Chips Thermal Control

With MATLAB® Applications
1. Auflage 2022
ISBN: 978-1-032-03353-2
Verlag: Chapman and Hall/CRC

Buch, Englisch, 174 Seiten, Format (B × H): 161 mm x 240 mm, Gewicht: 435 g

Reihe: Advances in Metaheuristics

The continuous miniaturization of integrated circuit (IC) chips and the increase in the sleekness of the design of electronic components have led to the monumental rise of volumetric heat generation in electronic components.

Hybrid Genetic Optimization for IC Chips Thermal Control: With MATLAB® Applications focuses on the detailed optimization strategy carried out to enhance the performance (temperature control) of the IC chips oriented at different positions on a switch-mode power supply (SMPS) board and cooled using air under various heat transfer modes. Seven asymmetric protruding IC chips mounted at different positions on an SMPS board are considered in the present study that is supplied with non-uniform heat fluxes.

Key Features:

- Provides guidance on performance enhancement and reliability of IC chips

- Provides a detailed hybrid optimization strategy for the optimal arrangement of IC chips on a board

- The MATLAB program for the hybrid optimization strategy along with its stability analysis is carried out in a detailed manner

- Enables thermal design engineers to identify the positioning of IC chips on the board to increase their reliability and working cycle

Zielgruppe

Academic, Postgraduate, Professional, and Undergraduate Advanced

Autoren/Hrsg.

V. K., Mathew

Hotta, Tapano Kumar

Fachgebiete

• Mathematik | Informatik EDV | Informatik Programmierung | Softwareentwicklung Programmierung: Methoden und Allgemeines
• Mathematik | Informatik EDV | Informatik Business Application Mathematische & Statistische Software
• Mathematik | Informatik EDV | Informatik Programmierung | Softwareentwicklung Programmier- und Skriptsprachen
• Mathematik | Informatik EDV | Informatik Programmierung | Softwareentwicklung Spiele-Programmierung, Rendering, Animation
• Mathematik | Informatik Mathematik Numerik und Wissenschaftliches Rechnen Optimierung

Inhaltsverzeichnis

ACKNOWLEDGEMENT

NOMENCLATURE

ABBREVIATIONS

CHAPTER 1

INTRODUCTION

1.1   Need for electronic cooling

1.2   Printed circuit board (PCB) and Integrated circuit (IC) chips 

1.3   Various cooling techniques

1.3.1 Air cooling

1.3.2 Phase change material based cooling 

1.4   Optimization in heat transfer 

CHAPTER 2

STATE OF THE ART STUDIES IN ELECTRONIC COOLING

2.1   Introduction

2.2   Studies pertaining to cooling of discrete IC chips

2.2.1 Studies relevant to Natural convection

2.2.2      Studies relevant to forced and mixed convection cooling of discrete IC chips

2.2.3      Studies pertaining to the phase change material (PCM) based cooling of discrete IC chips  

2.3      Summary of the literature survey

2.4   Scope for development 

2.5      Different parameters considered for the study

CHAPTER 3

EXPERIMENTAL FACILITY

3.1   Introduction

3.2   Selection of the IC chips and the SMPS board

3.3 Design of the IC chip and SMPS Board

3.3.1 Design of IC Chips

3.3.2 Design of the SMPS (Substrate) board

3.3.2.1 Substrate board design to carry out the laminar forced convection experiments

3.3.2.2 Substrate board design to carry out the experiments using the PCM filled mini-channels  

3.4   Experimental setup and Instrumentation

3.4.1 Instruments used for the experimental analysis

3.4.1.1 DC power source

3.4.1.2  Hot wire anemometer 

3.4.1.3 Temperature data-logger 

3.4.1.4 Digital multimeter 

3.4.1.5 Kapton tape

3.5   Experimental methodology

3.5.1 Procedure for conducting laminar forced convection steady-state experiments

3.5.2       Procedure for conducting transient experiments on the PCM filled mini-channels under the natural convection

3.6   Experimental calculations

3.6.1 Exp

Über Autor(innen)

Dr. Mathew V. K. holds a Ph.D. degree in Thermal Management Systems from Vellore Institute of Technology, Vellore, India; M.Tech in Heat Power from the University of Pune, India. He is working in the field of heat transfer enhancement using active and passive cooling. His research interest includes Active and passive safety, Crash energy management, Battery thermal management system, Computational fluid dynamics, Heat transfer, Numerical methods, Optimization using different algorithms (Genetic algorithm, Artificial neural network), and proficient in Experimental techniques.

Dr. Tapano Kumar Hotta is currently working as an Associate Professor in the School of Mechanical Engineering, VIT Vellore, India. He has a Ph.D. degree in Mechanical Engineering from IIT Madras in the area of Electronic cooling. His area of research in a broad sense includes; Active and passive cooling of electronic devices, Heat transfer enhancement, Optimization of thermal systems, Thermal comfort modeling, etc. Dr. Hotta has about 13 years of teaching cum research experience and has around 40 publications to his credit in journals and conferences of international repute. He has guided more than 30 undergraduates, a dozen of postgraduates, and 2 doctorate students for their project work. He has also published 2 patents. He is a member of the editorial board and reviewer for various international journals and conferences related to heat transfer.