Electronic Packaging for High Reliability, Low Cost Electronics

1. Auflage. Softcover version of original hardcover Auflage 1998
ISBN: 978-90-481-5085-4
Verlag: Springer Netherlands

Buch, Englisch, Band 57, 296 Seiten, Paperback, Format (B × H): 155 mm x 235 mm, Gewicht: 470 g

Reihe: NATO Science Partnership Subseries: 3

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

Zielgruppe

Research

Autoren/Hrsg.

Tummala, R. R.

Belavic, Darko

Kosec, Marija

Jones, W. K.

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Werkstoffprüfung
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Verbundwerkstoffe
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Elektronische Baugruppen, Elektronische Materialien
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Werkstoffkunde, Materialwissenschaft: Forschungsmethoden
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren

Inhaltsverzeichnis

Preface. Performance Predictions. Possibilities of Thermal Resonance in Microcircuits; G. De Mey. Signal Integrity Analysis in Cost Sensitive Interconnections; P. Svasta, et al. The Use of Nonlinearity Measurements for the Reliability Assessment; P.J. Mach. Effect of Plastic Package Geometry on its Propensity to Moisture Induced Failure; E. Suhir. The Impact of Stress on the Noise, Quality and Reliability of Passive and Active Devices; J. Sikula, P. Vasina. Process and Materials Development. Smart Unit for Technological Monitoring in Electrochemical Industry; R. Ionescu, et al. Lower Patterning of Printed Wiring Boards for MCM-Ls; ZS. Illyefalvi-Vitéz, et al. Silver Filled Adhesives-Controlling Rheology and Electrical Conductivity; P. Sexton, et al. Silicides Formation in Metal-Silicon Film Systems: The Role of Impurities; Yu. Makogon, S.I. Sidorenko. Mechanical properties of Pb-Sn-In-Ag Solders from -100°C to 150°C; W.K. Jones, et al. MCM-D/L. The Need for Low Cost, High Density Packaging and Interconnect Technology; P. Garrou. Application of Electroconducting Polymers in Low Cost Devices; G. Harsanyi, et al. Photosensitive Polymer Thick Films; S. Achmatowicz, et al. Characteristics of Passive Ta-Resistive Planes Embedded in Al-Sheet `PCB'-Compatible for Integrated MCM-Substrates or Packaging Carriers; P. Philippov. MCM-C. Use of Gravure Offset Printing in Manufacturing of Electronic Applications; S.J. Leppävuori, A.K. Uusimäki. Investigation of Thick Film Resistors for a Multilayer System; M. Hrovat, et al. Reliability Aspects of the Batch Production Based on PTF Technology; M. Somora, et al. A Five Layer Thin Film MCM-Si Design Using Oxynitride Dielectrics; J. Lernout, et al. Packaging Applications. An ASIC View of Low Cost Packaging; P.R. Van Loan. Packaging Technologies for Thick Film Sensors; D. Belavič, et al. Radiation Hardened ASIC Design for Space Applications; J. Trontelj, L. Trontelj. Low Cost Packaging Encoder Circuits; S. Amon, et al. Microwave Filters Manufactured by Advanced Thick-Film Techniques and Novel Silver Pastes; M. Cież, et al. Systems Level Packaging. System Reliability; N. Sinnadurai. Capabilities and Limitations in Microelectronic Packaging and Assembly within the FSU; S. Muckett. MCM-L in IBM Technology Overview; G. Vendramin. Applications of the Interconnected Mesh Power System (IMPS) Substrate Layer Reduction Topology; L.W. Schaper. Flip Chip and BGA Assembly. Plastic Ball Grid Array (PBGA): A Rising Package Solution; K. Kurzweil, et al. Low Cost Flip Chip on Glass Epoxy FR4 Substrates for Personal Electronics; N. Van Veen. Chip Stacking using Flip Chip Technologies; M. Amskov. Flip Chip Joining Technology Applications; J. Vähäkangas, et al. Novel Underfills: Effect of the Filler for Fast-Flow Underfills and Latent Catalyst for No-Flow Underfills on the Processing of Flip Chip Devices; C.P. Wong, et al. Author Index. Keyword Index.