More than Moore Technologies for Next Generation Computer Design

Softcover Nachdruck of the original 1. Auflage 2015
ISBN: 978-1-4939-4710-2
Verlag: Springer

Buch, Englisch, 218 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 3933 g

This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.

Zielgruppe

Professional/practitioner

Autoren/Hrsg.

Topaloglu, Rasit O.

Fachgebiete

• Mathematik | Informatik EDV | Informatik Informatik Rechnerarchitektur
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Schaltungsentwurf
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren

Inhaltsverzeichnis

Impact of TSV and Device Scaling on the Quality of 3D Ics.- 3D Integration Technology.- Design and Optimization of Spin-Transfer Torque MRAMs.- Embedded STT-MRAM: Device and Design.- A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis.- Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors.- Design Automation for On-chip Nanophotonic Integration.

Über Autor(innen)

Rasit O. Topaloglu is an Advisory R&D Engineer at IBM.