Advanced Flip Chip Packaging

2013
ISBN: 978-1-4419-5767-2
Verlag: Springer US

Buch, Englisch, 560 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 10723 g

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Zielgruppe

Research

Autoren/Hrsg.

Tong, Ho-Ming

Wong, C. P.

Lai, Yi-Shao

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Elektronische Baugruppen, Elektronische Materialien

Inhaltsverzeichnis

Flip Chip Technology Overview and Early Beginnings.- Technology Trends of Flip Chip.- Bumping Technologies.- Flip-Chip Interconnections: Past, Present and Future.- Underfill.- Conductive Adhesives for Flip Chip Applications.- Enabling Substrate Technologies: Past, Present and Future.- IC-Package-System Integrated Design.- Thermal Management of Flip Chip Packages.- Thermo-Mechanical Reliability in Flip Chip Packages.-  Interfacial Reactions and Electromigration in Flip-Chip Solder Joints.