Tilli / Paulasto-Kröckel / Motooka Handbook of Silicon Based MEMS Materials and Technologies

2. Auflage 2015
ISBN: 978-0-323-31223-3
Verlag: Elsevier Science & Techn.
Format: EPUB
Kopierschutz: 6 - ePub Watermark

E-Book, Englisch, 826 Seiten

Reihe: Micro and Nano Technologies

The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures - Geared towards practical applications rather than theory

Autoren/Hrsg.

Tilli, Markku

Paulasto-Kröckel, Mervi

Motooka, Teruaki

Lindroos, Veikko

Leseproben

List of Contributors

Timo Aalto,     VTT Technical Research Centre of Finland LTD, Espoo, Finland

Veli-Matti Airaksinen,     IMARINS, Espoo, Finland

Marco Amiotti,     SAES Getters S.p.A., Lainate, Italy

Olli Anttila,     Silicom Ltd., Helsinki, Finland

Antonio Bonucci,     SAES Getters S.p.A., Lainate, Italy

K. Brudzinski,     The Nordic Hysitron Laboratory, Helsinki University of Technology, Espoo, Finland

Rob N. Candler,     Department of Electrical Engineering, University of California, Los Angeles, USA

Zhen Cao,     Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong

Kuo-Shen Chen,     Department of Mechanical Engineering, National Cheng-Kung University Tainan, Tainan, Taiwan

Andrea Conte,     SAES Getters S.p.A., Lainate, Italy

Cristina E. Davis,     Department of Mechanical and Aerospace Engineering, University of California, Davis, USA

Pradeep Dixit,     Department of Mechanical Engineering, Indian Institute of Technology, Bombay, India

Viorel Dragoi,     EV Group E.Thallner GmbH, St. Florian/Inn, Austria

Simo Eränen,     VTT Technical Research Centre of Finland LTD, Espoo, Finland

Andreas C. Fischer,     Department of Micro and Nanosystems, KTH Royal Institute of Technology, Stockholm, Sweden

Sami Franssila,     Department of Materials Science and Engineering, Aalto University, Espoo, Finland

Alois Friedberger,     EADS Innovation Works, München, Germany

Maria Ganchenkova,     Department of Applied Physics, Aalto University, Espoo, Finland

Pilar Gonzalez,     Interuniversity Microelectronics Centre (IMEC), Leuven, Belgium

Miguel A. Gosálvez,     Laboratory of Physics, Aalto University, Espoo, Finland

J. Gronicz,     The Nordic Hysitron Laboratory, Helsinki University of Technology, Espoo, Finland

Atte Haapalinna,     Okmetic Oyj, Vantaa, Finland

Paul M. Hagelin,     SiTime Corporation, Sunnyvale, USA

Paul Hammond,     SPTS Technologies, Allentown, USA

Kimmo Henttinen,     Okmetic Oyj, Vantaa, Finland

David Horsley,     Department of Mechanical and Aerospace Engineering, University of California, Davis, USA

Akihisa Inoue,     Institute for Materials Research, Tohoku University, Sendai, Japan

Henrik Jakobsen,     Department of Micro and Nano Systems Technology, Buskerud and Vestfold University College, Borre, Norway

Kerstin Jonsson,     NanoSpace AB, Uppsala Science Park, Uppsala, Sweden

Dirk Kähler,     Fraunhofer Institute for Silicon Technology (ISIT), Itzehoe, Germany

Hannu Kattelus,     VTT MEMSFAB, Espoo, Finland

Roy Knechtel,     X-FAB MEMS Foundry GmbH Erfurt, Haarbergstraße, Germany

Kathrin Knese,     Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany

Kai Kolari

VTT Technical Research Centre of Finland LTD, Espoo, Finland

currently at Murata Electronics, Vantaa, Finland

Mika Koskenvuori,     Nanofab, Micronova, Aalto University, Espoo, Finland

Heikki Kuisma,     Murata Electronics Oyj, Vantaa, Finland

Amit Kulkarni,     Fraunhofer Institute for Silicon Technology (ISIT), Itzehoe, Germany

Franz Laermer,     Robert Bosch GmbH Stuttgart, Germany, Applied Research 1, Microsystems Technologies

Adriana Cozma Lapadatu,     poLight AS, Horten, Norway

Christina Leinenbach,     Robert Bosch GmbH, Stuttgart, Germany

Michael K. LeVasseur,     Department of Mechanical and Aerospace Engineering, University of California, Davis, USA

Jue Li,     Department of Electrical Engineering and Automation, Aalto University, Espoo, Finland

Paul Lindner,     EV Group E.Thallner GmbH, St. Florian/Inn, Austria

Veikki Lindroos,     Department of Materials Science and Engineering, Aalto University, Espoo, Finland

Fabian Lofink,     Fraunhofer Institute for Silicon Technology (ISIT), Itzehoe, Germany

Giorgio Longoni,     SAES Getters S.p.A., Lainate, Italy

Jari Mäkinen,     Okmetic Oyj, Vantaa, Finland

Matti Mäntysalo,     Department of Electronics and Communications Engineering, Tampere University of Technology, Tampere, Finland

Devin Martin,     DISCO HI-TEC America, Inc., Santa Clara, USA

Toni Mattila,     Department of Electrical Engineering and Automation, Aalto University, Espoo, Finland

Luca Mauri,     SAES Getters S.p.A., Lainate, Italy

Peter Merz,     XFAB MEMS Foundry GmbH, Itzehoe, Germany

Doug Meyer,     Gallia Semiconductor, Portland, USA

Marco Moraja,     SAES Getters S.p.A., Lainate, Italy

Teruaki Motooka,     Department of Materials Science and Engineering, Kyushu University, Fukuoka, Japan

Gerhard Müller,     EADS Innovation Works, München, Germany

Paul Muralt,     EPFL, Lausanne, Switzerland

S. Nagao,     The Nordic Hysitron Laboratory, Helsinki University of Technology, Espoo, Finland

Risto M. Nieminen,     Department of Applied Physics, Aalto University, Espoo, Finland

Frank Niklaus,     Department of Micro and Nanosystems, KTH Royal Institute of Technology, Stockholm, Sweden

R. Nowak,     Department of Materials Science and Engineering and The Nordic Hysitron Laboratory, Aalto University, Espoo, Finland

Juuso Olkkonen,     VTT Technical Research Centre of Finland LTD, Espoo, Finland

Kuang-Shun Ou,     Department of Mechanical Engineering, National Cheng-Kung University Tainan, Tainan, Taiwan

Jari Paloheimo,     Okmetic Oyj, Vantaa, Finland

Mervi Paulasto-Kröckel,     Department of Electrical Engineering and Automation, Aalto University, Espoo, Finland

Helena Pohjonen,     Nokia Technologies, Espoo, Finland

Klaus Pressel,     Infineon Technologies AG, Regensburg, Germany

Matti Putkonen,     VTT Technical Research Centre of...