Tilli / Paulasto-Kröckel / Motooka Handbook of Silicon Based MEMS Materials and Technologies

2. Auflage 2015
ISBN: 978-0-323-31223-3
Verlag: Elsevier Science & Techn.
Format: EPUB
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 826 Seiten

Reihe: Micro and Nano Technologies

The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures - Geared towards practical applications rather than theory

Autoren/Hrsg.

Tilli, Markku

Paulasto-Kröckel, Mervi

Motooka, Teruaki

Lindroos, Veikko

Leseproben

List of Contributors
Timo Aalto,     VTT Technical Research Centre of Finland LTD, Espoo, Finland Veli-Matti Airaksinen,     IMARINS, Espoo, Finland Marco Amiotti,     SAES Getters S.p.A., Lainate, Italy Olli Anttila,     Silicom Ltd., Helsinki, Finland Antonio Bonucci,     SAES Getters S.p.A., Lainate, Italy K. Brudzinski,     The Nordic Hysitron Laboratory, Helsinki University of Technology, Espoo, Finland Rob N. Candler,     Department of Electrical Engineering, University of California, Los Angeles, USA Zhen Cao,     Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong Kuo-Shen Chen,     Department of Mechanical Engineering, National Cheng-Kung University Tainan, Tainan, Taiwan Andrea Conte,     SAES Getters S.p.A., Lainate, Italy Cristina E. Davis,     Department of Mechanical and Aerospace Engineering, University of California, Davis, USA Pradeep Dixit,     Department of Mechanical Engineering, Indian Institute of Technology, Bombay, India Viorel Dragoi,     EV Group E.Thallner GmbH, St. Florian/Inn, Austria Simo Eränen,     VTT Technical Research Centre of Finland LTD, Espoo, Finland Andreas C. Fischer,     Department of Micro and Nanosystems, KTH Royal Institute of Technology, Stockholm, Sweden Sami Franssila,     Department of Materials Science and Engineering, Aalto University, Espoo, Finland Alois Friedberger,     EADS Innovation Works, München, Germany Maria Ganchenkova,     Department of Applied Physics, Aalto University, Espoo, Finland Pilar Gonzalez,     Interuniversity Microelectronics Centre (IMEC), Leuven, Belgium Miguel A. Gosálvez,     Laboratory of Physics, Aalto University, Espoo, Finland J. Gronicz,     The Nordic Hysitron Laboratory, Helsinki University of Technology, Espoo, Finland Atte Haapalinna,     Okmetic Oyj, Vantaa, Finland Paul M. Hagelin,     SiTime Corporation, Sunnyvale, USA Paul Hammond,     SPTS Technologies, Allentown, USA Kimmo Henttinen,     Okmetic Oyj, Vantaa, Finland David Horsley,     Department of Mechanical and Aerospace Engineering, University of California, Davis, USA Akihisa Inoue,     Institute for Materials Research, Tohoku University, Sendai, Japan Henrik Jakobsen,     Department of Micro and Nano Systems Technology, Buskerud and Vestfold University College, Borre, Norway Kerstin Jonsson,     NanoSpace AB, Uppsala Science Park, Uppsala, Sweden Dirk Kähler,     Fraunhofer Institute for Silicon Technology (ISIT), Itzehoe, Germany Hannu Kattelus,     VTT MEMSFAB, Espoo, Finland Roy Knechtel,     X-FAB MEMS Foundry GmbH Erfurt, Haarbergstraße, Germany Kathrin Knese,     Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany Kai Kolari VTT Technical Research Centre of Finland LTD, Espoo, Finland currently at Murata Electronics, Vantaa, Finland Mika Koskenvuori,     Nanofab, Micronova, Aalto University, Espoo, Finland Heikki Kuisma,     Murata Electronics Oyj, Vantaa, Finland Amit Kulkarni,     Fraunhofer Institute for Silicon Technology (ISIT), Itzehoe, Germany Franz Laermer,     Robert Bosch GmbH Stuttgart, Germany, Applied Research 1, Microsystems Technologies Adriana Cozma Lapadatu,     poLight AS, Horten, Norway Christina Leinenbach,     Robert Bosch GmbH, Stuttgart, Germany Michael K. LeVasseur,     Department of Mechanical and Aerospace Engineering, University of California, Davis, USA Jue Li,     Department of Electrical Engineering and Automation, Aalto University, Espoo, Finland Paul Lindner,     EV Group E.Thallner GmbH, St. Florian/Inn, Austria Veikki Lindroos,     Department of Materials Science and Engineering, Aalto University, Espoo, Finland Fabian Lofink,     Fraunhofer Institute for Silicon Technology (ISIT), Itzehoe, Germany Giorgio Longoni,     SAES Getters S.p.A., Lainate, Italy Jari Mäkinen,     Okmetic Oyj, Vantaa, Finland Matti Mäntysalo,     Department of Electronics and Communications Engineering, Tampere University of Technology, Tampere, Finland Devin Martin,     DISCO HI-TEC America, Inc., Santa Clara, USA Toni Mattila,     Department of Electrical Engineering and Automation, Aalto University, Espoo, Finland Luca Mauri,     SAES Getters S.p.A., Lainate, Italy Peter Merz,     XFAB MEMS Foundry GmbH, Itzehoe, Germany Doug Meyer,     Gallia Semiconductor, Portland, USA Marco Moraja,     SAES Getters S.p.A., Lainate, Italy Teruaki Motooka,     Department of Materials Science and Engineering, Kyushu University, Fukuoka, Japan Gerhard Müller,     EADS Innovation Works, München, Germany Paul Muralt,     EPFL, Lausanne, Switzerland S. Nagao,     The Nordic Hysitron Laboratory, Helsinki University of Technology, Espoo, Finland Risto M. Nieminen,     Department of Applied Physics, Aalto University, Espoo, Finland Frank Niklaus,     Department of Micro and Nanosystems, KTH Royal Institute of Technology, Stockholm, Sweden R. Nowak,     Department of Materials Science and Engineering and The Nordic Hysitron Laboratory, Aalto University, Espoo, Finland Juuso Olkkonen,     VTT Technical Research Centre of Finland LTD, Espoo, Finland Kuang-Shun Ou,     Department of Mechanical Engineering, National Cheng-Kung University Tainan, Tainan, Taiwan Jari Paloheimo,     Okmetic Oyj, Vantaa, Finland Mervi Paulasto-Kröckel,     Department of Electrical Engineering and Automation, Aalto University, Espoo, Finland Helena Pohjonen,     Nokia Technologies, Espoo, Finland Klaus Pressel,     Infineon Technologies AG, Regensburg, Germany Matti Putkonen,     VTT Technical Research Centre of...