Buch, Englisch, Band 201, 375 Seiten
Reihe: Microsystems
The Art and Science of Microsystem Packaging is writtenfor microsystem, MEMS and microfabrication engineers who are designing microsystem packages or systems that use microsystem package technology.
Thisbook is a reference for practicing engineers, both industrial and academic, who are designing either micromachined products or products that contain micromachined devices. Emphasis is placed on materials, technologies and assembly processes and guidelines that are either being used in production today, are production worthy, or have a good chance of being developed to a level needed to package a saleable product. The reader is assumed to have general understanding of micromachined concepts and semiconductor fabrication technology.
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
- Naturwissenschaften Physik Quantenphysik
- Technische Wissenschaften Technik Allgemein Konstruktionslehre und -technik
- Technische Wissenschaften Technik Allgemein Nanotechnologie
- Geisteswissenschaften Design Produktdesign, Industriedesign
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
Weitere Infos & Material
Introduction.- Microsystem Packaging Materials.- Bonding, Joints, and Adhesion.- Printing and Plating for Microsystems Packages.- Wafer-Level Microsystem Packaging.- Component-Level Package Assembly Processes.- Hermetic First-Level Packages.- Plastic and Substrate Packages.- Package Design Considerations.- Units and Unit Conversion.- Properties of Microsystem Package Materials.- IC Package Body Styles
