Buch, Englisch, 144 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 448 g
Buch, Englisch, 144 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 448 g
ISBN: 978-981-13-8050-1
Verlag: Springer Nature Singapore
This book discusses the recent research developments of various passive microwave circuits on silicon substrate and demonstrated operations catering for multiple frequency bands. It covers the design, modelling, process fabrication and characterization aspects with practical examples. The book will be of use to researchers and engineers working in the field of RF or microwave engineering, who can use the techniques and approaches effectively without having to refer to multiple sources.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Nachrichten- und Kommunikationstechnik Drahtlostechnologie
Weitere Infos & Material
Chapter 1: Silicon implementation of Planar Topologies.- Chapter-2: Fabrication technologies.- Chapter 3: Passive Circuits.- Chapter-4: Planar Antenna.- Chapter-5: MEMS Switch.- Chapter-6: Packaging concept in Radio Frequency.- Appendix-1: Material properties of some useful metals and dielectrics.- Appendix 2: Relaxation time estimation for some materials used in RF/microwave applications.- Appendix 3: Etch rate of various thin films of in wet and dry method.- Appendix 4: Readymade Chart for VSWR, Return Loss and Reflection Coefficient.