E-Book, Englisch, 278 Seiten, eBook
E-Book, Englisch, 278 Seiten, eBook
Reihe: Integrated Circuits and Systems
ISBN: 978-1-4419-7618-5
Verlag: Springer US
Format: PDF
Kopierschutz: 1 - PDF Watermark
Zielgruppe
Professional/practitioner
Autoren/Hrsg.
Weitere Infos & Material
Three-Dimensional Integration of Integrated Circuits - an Introduction.- The Promises and Limitation of 3-D Integration.- Testing 3D Stacked ICs Containing Through-Silicon Vias.- Design and Computer Aided Design of 3DIC.- Physical Analysis of NoC Topologies for 3-D Integrated Systems.- Three-Dimensional Networks-on-Chip: Performance Evaluation.- Asynchronous 3D-NoCs.- Design of Application-Specific 3D Networks-on-Chip Architectures.- 3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks.- 3-D NoC on Inductive Wireless Interconnect.- Influence of Stacked 3D Memory/Cache architectures on GPUs.