E-Book, Englisch, 134 Seiten, eBook
Reihe: Conference Proceedings of the Society for Experimental Mechanics Series
Shaw III / Prorok / Starman MEMS and Nanotechnology, Volume 5
2014
ISBN: 978-3-319-00780-9
Verlag: Springer International Publishing
Format: PDF
Kopierschutz: 1 - PDF Watermark
Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics
E-Book, Englisch, 134 Seiten, eBook
Reihe: Conference Proceedings of the Society for Experimental Mechanics Series
ISBN: 978-3-319-00780-9
Verlag: Springer International Publishing
Format: PDF
Kopierschutz: 1 - PDF Watermark
MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:
Microelectronics Packaging
Single Atom/Molecule Mechanical Testing
MEMS Devices & Fabrication
In-Situ Mechanical Testing
Nanoindentation
Experimental Analysis of Low-Dimensional Materials for Nanotechnology
Zielgruppe
Research
Autoren/Hrsg.
Weitere Infos & Material
Warpage Measurement of Simulated Electronic Packaging Assembly.- Nanomechanical Characterization of Lead Free Solder Joints.- In-Situ Surface Mount Process Characterization Using Digital Image Correlation.- Acoustic Waveform Energy as an Interconnect Damage Indicator.- Shape Optimization of Cantilevered Piezoelectric Devices.- Unique Fabrication Method for Novel MEMS Micro-contact Structure.- A Frequency Selective Surface Design Fabricated With Tunable RF Meta-atoms.- Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-Robotics.- MEMS Cantilever Sensor Design for Photoacoustic Detection of Terahertz Radiation.- In-Plane MEMS Acoustic Emission Sensors Development and Experimental Characterization.- New Insight into Pile-Up in Thin Film Indentation.- Mapping the Mechanical Properties of Alloyed Magnesium (AZ 61).- Temperature Dependent Micromechanical Testing on the Formation of Cu/Sn Intermetallic Thin Films.- Molecular Interactions on InxGa1-xN.- Timoshenko Beam Model for Lateral Vibration of Liquid-Phase Microcantilever-Based Sensors.- Improvement in Uncertainty of Tuning Fork-based Force Sensor Stiffness Calibration via the Indentation Method Using Direct Determination of Contact and Machine Compliance.- Flexible Terahertz Metamaterials for Frequency Selective Surfaces.
