Buch, Englisch, 508 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 955 g
Reihe: EAI/Springer Innovations in Communication and Computing
ICECENG 2024
Buch, Englisch, 508 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 955 g
Reihe: EAI/Springer Innovations in Communication and Computing
ISBN: 978-3-031-88998-1
Verlag: Springer
This proceedings presents the papers included in the 3rd International Congress of Electrical and Computer Engineering (ICECENG), which took place in Bandirma, Turkey, 27-30 November 2024. The conference aims to bring together researchers, developers, and students in computing, technology trends, artificial intelligence, and security who are interested in studying the application of formal methods to the construction and analysis of models describing technological processes at both micro and macro levels. ICECENG’24 also aims to provide a platform for discussing the issues, challenges, opportunities, and findings of computer engineering research. The conference seeks to provide some answers and explore the processes, actions, challenges, and outcomes of learning and teaching.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Introduction.- Computing.- Quantum Computing.- Cognitive Computing.- High Performance Computing.- Distributed and parallel systems.- Social Computing.- Cloud Computing.- Grid Computing.- Human-centered Computing.- Mobile Computing.- Complex Systems.- Communication.- Networking.- Wireless/ Mobile Communication.- Satellite Communication Systems.- 3G/4G/5G Network Evolution.- Connected Machines.- Mobile Adhoc Networks.- Open Spectrum Solutions.- Communication Protocols.- Cognitive Radio.- Mobile Apps.- Signal Processing.- Conclusion.




