Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Softcover Nachdruck of the original 1. Auflage 2018
ISBN: 978-3-030-08561-2
Verlag: Springer International Publishing

Buch, Englisch, 115 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 201 g

Reihe: Springer Series in Advanced Manufacturing

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.

Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

Zielgruppe

Research

Autoren/Hrsg.

Seok, Seonho

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Fertigungstechnik
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau Tribologie
• Technische Wissenschaften Technik Allgemein Nanotechnologie
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Biomaterialien, Nanomaterialien, Kohlenstoff
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Werkstoffprüfung

Inhaltsverzeichnis

Overview of MEMS packaging technologies.- Adhesion control techniques for debonding.- FEM modeling of debonding.- Polymer cap transfer packaging technologies.- Thin film cap transfer packaging technology.- Other related manufacturing technologies.