Schlesinger / Paunovic Modern Electroplating

5. Auflage 2011
ISBN: 978-1-118-06314-9
Verlag: John Wiley & Sons
Format: EPUB
Kopierschutz: 0 - No protection

E-Book, Englisch, 736 Seiten, E-Book

Reihe: Electrochemical Society Series

The definitive resource for electroplating, now completely up todate
With advances in information-age technologies, the field ofelectroplating has seen dramatic growth in the decade since theprevious edition of Modern Electroplating was published. Thisexpanded new edition addresses these developments, providing acomprehensive, one-stop reference to the latest methods andapplications of electroplating of metals, alloys, semiconductors,and conductive polymers.
With special emphasis on electroplating and electrochemicalplating in nanotechnologies, data storage, and medicalapplications, the Fifth Edition boasts vast amounts of new andrevised material, unmatched in breadth and depth by any other bookon the subject. It includes:
* Easily accessible, self-contained contributions by over thirtyexperts
* Five completely new chapters and hundreds of additionalpages
* A cutting-edge look at applications in nanoelectronics
* Coverage of the formation of nanoclusters and quantum dots usingscanning tunneling microscopy (STM)
* An important discussion of the physical properties of metal thinfilms
* Chapters devoted to methods, tools, control, and environmentalissues
* And much more
A must-have for anyone in electroplating, including technicians,platers, plating researchers, and metal finishers, ModernElectroplating, Fifth Edition is also an excellent reference forelectrical engineers and researchers in the automotive, datastorage, and medical industries.

Autoren/Hrsg.

Schlesinger, Mordechay

Paunovic, Milan

Inhaltsverzeichnis

PREFACE.
PREFACE TO THE FOURTH EDITION.
CONTRIBUTORS.
CONVERSION FACTORS.
GRAPHICAL CONVERSION.
THE ELECTROCHEMICAL SOCIETY SERIES.
1 Fundamental Considerations (Milan Paunovic, MordechaySchlesinger, and Dexter D. Snyder).
2 Electrodeposition of Copper (Jack W. Dini and Dexter D.Snyder).
3 Electrodeposition of Nickel (George A. Di Bari).
4 Electrodeposition of Gold (Paul A. Kohl).
5 Electroless and Electrodeposition of Silver (MordechaySchlesinger).
6 Tin and Tin Alloys for Lead-Free Solder (YunZhang).
7 Electrodeposition of Chromium (Nenad V. Mandich and DonaldL. Snyder).
8 Electrodeposition of Lead and Lead Alloys (ManfredJordan).
9 Electrodeposition of Tin?Lead Alloys (ManfredJordan).
10 Electrodeposition of Zinc and Zinc Alloys (RenWinand).
11 Electrodeposition of Iron and Iron Alloys (MasanobuIzaki).
12 Palladium Electroplating (Joseph A. Abys).
13 Electrochemical Deposition Process for ULSI InterconnectionDevices (Tetsuya Osaka and Masahiro Yoshino).
14 Electrodeposition of Semiconductors (T. E. Schlesinger, K.Rajeshwar, and N. R. De Tacconi).
15 Deposition on Nonconductors (MordechaySchlesinger).
16 Conductive Polymers: Electroplating of Organic Films(Tetsuya Osaka, Shinichi Komaba, and Toshiyuki Momma).
17 Electroless Deposition of Copper (Milan Paunovic).
18 Electroless Deposition of Nickel (MordechaySchlesinger).
19 Electrochemical Synthesis of Metal Alloys for MagneticRecording Systems (Atsushi Sugiyama, Masahiro Yoshino, TakumaHachisu, and Tetsuya Osaka).
20 Electroless Deposition of Palladium and Platinum (IzumiOhno).
21 Electroless Deposition of Gold (Yutaka Okinaka and MasaruKato).
22 Electroless Deposition of Alloys (Izumi Ohno).
23 Preparation for Deposition (Dexter D. Snyder).
24 Manufacturing Tools (Tom Ritzdorf).
25 Monitoring and Control (Tom Ritzdorf).
26 Environmental Aspects of Electrodeposition (MichaTomkiewicz).
27 Applications to Magnetic Recording and MicroelectronicTechnologies (Stanko R. Brankovic, Natasa Vasiljevic, andNikolay Dimitrov).
28 Microelectromechanical Systems (Giovanni Zangari).
29 Analysis of Electroplated Films Using Dual-Beam FIB/SEM andTEM Techniques (Xianying Meng-Burany).
30 Ionic Liquid Treatments for Enhanced Corrosion Resistance ofMagnesium-Based Substrates (R. Petro, M. Schlesinger, andGuang-Ling Song).
APPENDIX.
INDEX.

Über Autor(innen)

MORDECHAY SCHLESINGER, PhD, is a professor in the Department ofPhysics at the University of Windsor, Ontario, Canada. He haspublished over 120 research papers, holds four patents, and hasserved as associate editor for the Journal of The ElectrochemicalSociety, Electrochemical and Solid-State Letters, and as coeditorof the Canadian Journal of Physics. Schlesinger is coauthor, withMilan Paunovic, of the first and second editions of Fundamentals ofElectrochemical Deposition and the previous edition of ModernElectroplating (both by Wiley).
MILAN PAUNOVIC, PhD, had, until his recent retirement, worked onelectrochemical metal deposition for over four decades, mostrecently in the Electrodeposition Technology Department at IBM's T.J. Watson Research Center, and previously at the University ofPennsylvania, Reynolds Metals, Kollmorgen, and Intel. In additionto coauthoring, with Mordechay Schlesinger, the first and secondeditions of Fundamentals of Electrochemical Deposition and theprevious edition of Modern Electroplating, Dr. Paunovic has editedsymposia proceedings for The Electrochemical Society, publishedforty-one research papers, and holds seven patents.