Buch, Englisch, Band 403, 354 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 5562 g
Reihe: IFIP Advances in Information and Communication Technology
4th IFIP TC 10 International Embedded Systems Symposium, IESS 2013, Paderborn, Germany, June 17-19, 2013, Proceedings
Buch, Englisch, Band 403, 354 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 5562 g
Reihe: IFIP Advances in Information and Communication Technology
ISBN: 978-3-642-43028-2
Verlag: Springer
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Mathematik | Informatik EDV | Informatik Technische Informatik Eingebettete Systeme
- Mathematik | Informatik EDV | Informatik Programmierung | Softwareentwicklung Software Engineering Modellierung, UML, SysML
- Mathematik | Informatik EDV | Informatik Programmierung | Softwareentwicklung Software Engineering Softwaretests & Prüfsoftware
Weitere Infos & Material
Design methodologies.- Non-functional aspects of embedded systems.- Verification.- Performance analysis.- Real-time systems.- Embedded system applications.- Real-time aspects in distributed systems.