Buch, Englisch, 471 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 727 g
Buch, Englisch, 471 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 727 g
Reihe: The European Consortium for Mathematics in Industry
ISBN: 978-3-642-42773-2
Verlag: Springer
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Mathematik | Informatik Mathematik Mathematik Interdisziplinär Systemtheorie
- Mathematik | Informatik Mathematik Numerik und Wissenschaftliches Rechnen Angewandte Mathematik, Mathematische Modelle
- Technische Wissenschaften Technik Allgemein Technik: Allgemeines
- Mathematik | Informatik Mathematik Numerik und Wissenschaftliches Rechnen Numerische Mathematik
- Technische Wissenschaften Energietechnik | Elektrotechnik Elektrotechnik
Weitere Infos & Material
Basic Concepts.- to Model Order Reduction.- Linear Systems, Eigenvalues, and Projection.- Theory.- Structure-Preserving Model Order Reduction of RCL Circuit Equations.- A Unified Krylov Projection Framework for Structure-Preserving Model Reduction.- Model Reduction via Proper Orthogonal Decomposition.- PMTBR: A Family of Approximate Principal-components-like Reduction Algorithms.- A Survey on Model Reduction of Coupled Systems.- Space Mapping and Defect Correction.- Modal Approximation and Computation of Dominant Poles.- Some Preconditioning Techniques for Saddle Point Problems.- Time Variant Balancing and Nonlinear Balanced Realizations.- Singular Value Analysis and Balanced Realizations for Nonlinear Systems.- Research Aspects and Applications.- Matrix Functions.- Model Reduction of Interconnected Systems.- Quadratic Inverse Eigenvalue Problem and Its Applications to Model Updating — An Overview.- Data-Driven Model Order Reduction Using Orthonormal Vector Fitting.- Model-Order Reduction of High-Speed Interconnects Using Integrated Congruence Transform.- Model Order Reduction for MEMS: Methodology and Computational Environment for Electro-Thermal Models.- Model Order Reduction of Large RC Circuits.- Reduced Order Models of On-Chip Passive Components and Interconnects, Workbench and Test Structures.