Buch, Englisch, 377 Seiten, Format (B × H): 215 mm x 285 mm, Gewicht: 12382 g
Reihe: Conference Proceedings of the Society for Experimental Mechanics Series
Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics
Buch, Englisch, 377 Seiten, Format (B × H): 215 mm x 285 mm, Gewicht: 12382 g
Reihe: Conference Proceedings of the Society for Experimental Mechanics Series
ISBN: 978-3-319-00875-2
Verlag: Springer International Publishing
Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 8: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the eighth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:
Advances in Residual Stress Measurement Methods
Residual Stress Effects on Material Performance
Optical, Ultrasonic, and Diffraction Methods for Residual Stress Measurement
Thermomechanics & Infrared Imaging
Inverse Methods
Inverse Methods in Plasticity
Applications in Experimental Mechanics
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
From the Contents: Analysis of Thrust Production in Small Synthetic Flapping Wings.- Coarse-resolution Cone-beam Scanning of Logs Using Eulerian CT Reconstruction. Part I: Discretization and Algorithm.- Coarse-resolution Cone-beam Scanning of Logs Using Eulerian CT Reconstruction. Part II: Hardware Design and Demonstration.- Crack Nucleation Threshold Under Fretting Loading by a Thermal Method.- Crack Growth Study of Fibre Metal Laminates Using Thermoelastic Stress Analysis.- Crack Detection in Large Welded Components Under Fatigue Using TSA.- Hybrid Thermoelastic Analysis of an Unsymmetrically-loaded Structure containing an Arbitrarily-shaped Cutout.- Quantitative Themographic Characterization of Composites.- Thermal Deformation of Micro-structure Diffuser Plate in LED Backlight Unit.- Polariscopy Measurement of Residual Stress in Thin Silicon Wafers.
