Buch, Englisch, 377 Seiten, Format (B × H): 215 mm x 285 mm, Gewicht: 12382 g
Reihe: Conference Proceedings of the Society for Experimental Mechanics Series
Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics
Buch, Englisch, 377 Seiten, Format (B × H): 215 mm x 285 mm, Gewicht: 12382 g
Reihe: Conference Proceedings of the Society for Experimental Mechanics Series
ISBN: 978-3-319-00875-2
Verlag: Springer
Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 8: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics , the eighth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:
Advances in Residual Stress Measurement Methods
Residual Stress Effects on Material Performance
Optical, Ultrasonic, and Diffraction Methods for Residual Stress Measurement
Thermomechanics & Infrared Imaging
Inverse Methods
Inverse Methods in Plasticity
Applications in Experimental Mechanics
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
From the Contents: Analysis of Thrust Production in Small Synthetic Flapping Wings.- Coarse-resolution Cone-beam Scanning of Logs Using Eulerian CT Reconstruction. Part I: Discretization and Algorithm.- Coarse-resolution Cone-beam Scanning of Logs Using Eulerian CT Reconstruction. Part II: Hardware Design and Demonstration.- Crack Nucleation Threshold Under Fretting Loading by a Thermal Method.- Crack Growth Study of Fibre Metal Laminates Using Thermoelastic Stress Analysis.- Crack Detection in Large Welded Components Under Fatigue Using TSA.- Hybrid Thermoelastic Analysis of an Unsymmetrically-loaded Structure containing an Arbitrarily-shaped Cutout.- Quantitative Themographic Characterization of Composites.- Thermal Deformation of Micro-structure Diffuser Plate in LED Backlight Unit.- Polariscopy Measurement of Residual Stress in Thin Silicon Wafers.




