Buch, Englisch, 195 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 341 g
Buch, Englisch, 195 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 341 g
ISBN: 978-1-4419-5427-5
Verlag: Springer US
This book addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. Its orientation is towards giving general information rather than a compilation of practical cases. Each chapter contains a list of references for the topics.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Microelectronic Interconnections.- Interconnect Modeling in Circuit Simulation.- Crosstalk Effects in Digital Circuits.- Packaging Interconnects.- Techniques for Avoiding Interconnection Noise.- Noise Detection and Testing in Logic Circuits.




