A Story of an Advanced Technology Program in the Semiconductor Industry
Buch, Englisch, 211 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 3363 g
ISBN: 978-3-319-92700-8
Verlag: Springer International Publishing
This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program – but using a novelized form. The material is presented in a conversational format through a story that follows a fictional narrator as she grows from an intern to a manager in a (fictional) chip company. The story describes the technology development program from management, engineering and human perspectives, and exposes not only the management and technical issues but also the typical work-life balance challenges experienced by engineers working in the technology industry. Use of a series of realistic and representative vignettes, supported by a set of illustrative cartoon-ish panels, presents the serious management topics in a light and readable way.
Zielgruppe
Professional/practitioner
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Section 1: I, Intern (& Setting up an Advanced Tech Integration Program).- The Interview.- The Start.- The Background (and Beer with Cz).- The Challenge (Why do Advanced Technology Development).- The Value (of an Advanced Technology Program).- The Knobs (for Setting Up an Advanced Technology Effort).- The Proposals.- The Good-Bye.- A Technologist: Cz’s Contemplations (circa year 0).- Section 2: I, Engineer (& Running Integration Tech Development).- I’m Back!.- Managing Learning (in a Matrix Organization).- Managing Compensation (in a Matrix Organization).- Reorganization (into Line Organization).- The Challenge (How To Do the Integration Technology Development).- Test Chip Engagement (& the Assignment I did not get).- PathFinding Engagement (and the Assignment that I did get).- A Manager: Steve’s Soliloquy (circa + 3 years).- Section 3: I, Leader (Product Intersection & Handing off the Learning).- I’m Back!.- Process Transfer Case Study (IPD).- Methodology Transfer Case Study (Multi-Physics Stress Modeling).- Concept Transfer Case Study (2.5D Integration PathFinding).- The Big Picture (Development of More-than-Moore Integration Technologies).- A Businessman: Mao’s Musings (Circa + 5 years).