Buch, Englisch, 154 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 283 g
ISBN: 978-94-011-6975-2
Verlag: Springer
to Cera1l1ics by George C. Phillips ~ V AN NOSTRAND REINHOLD ~ ~ ____ New York Copyright ('> 1991 by Van Nostrand Reinhold Softcover reprint of the hardcover 1 st edition 1991 Library of COnRreSS Catalog Card Number 91·19587 ISBN·13: 978·94·011--6975·2 All rights eserve r d. No part of this work covered by the copyright hereon may be rcproduccd or uscd in any form or by any means-graphic. electronic. or meehaniclli. including photocopying. recording. taping. or information storage and retrieval systems-without written permission of the publisher. Manufactured in the United States of America Published by Van Nostrand Reinhold 115 Fifth Avenue New York. New York 10003 Chapman and Ha ll 2-6 Boundary Row London. SEI SHN. England Thomas Nelson Australia 102 Dodds Street South Melbourne 3205 Victoria. Australia Nelson Canada 1120 Birchmounl Road Scarborough. Ontario M IK 5G4. Canada 16 15 14 13 12 II 10 9 8 7 6 5 4 3 2 Library or Congress Cataloging-in· Publication Data Phillips. George C. 1937- A concise inlrodu!;tion to ceramics/by George C. Phillips. p. cm. Includes bibliographical referen!;es and index. ISBN-13: 978-94-011--6975-2 e-ISBN-13: 978-94-011--6973-8 001:10: 1007/978-94-011--6973-8 I. Cerami!;s. L Tille.
Zielgruppe
Research
Autoren/Hrsg.
Weitere Infos & Material
I—Overview of Ceramics.- 1. Ceramic Materials.- 2. Ceramic Raw Materials.- 3. Nature of Clay.- 4. Forming from Powders.- 5. Forming from Melts.- 6. Miscellaneous Forming Techniques.- 7. Traditional Ceramic Industries.- II—The Nature of Ceramic Materials (Bonding/Crystal Concepts).- 8. Atomic Structure.- 9. Bonding and Crystal Chemistry Concepts.- 10. Silicate Stuctures.- 11. Structure of Glass.- 12. Oxide Crystal Structures.- III—Characterization of Ceramic Materials.- 13. Analytical Techniques.- 14. Properties and Requirements of Ceramic Materials.- 15. Ceramic Surface Characteristics.- 16. Ceramic Strength Considerations.- IV—Hi-Tech Applications of Ceramics.- 17. Structural and Electronic Applications.- 18. Integrated Circuit Technology.- 19. Ceramic Packaging of IC Devices.- 20. The Future of Ceramics.
