Buch, Englisch, 892 Seiten, Format (B × H): 174 mm x 246 mm, Gewicht: 1678 g
Reihe: Mechanical Engineering
Buch, Englisch, 892 Seiten, Format (B × H): 174 mm x 246 mm, Gewicht: 1678 g
Reihe: Mechanical Engineering
ISBN: 978-0-8247-7921-4
Verlag: Taylor & Francis Inc
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
"Introduction, Michael D. Osterman and Michael Pecht Electronic Components, Denise BurkusHarris, Michael Pecht, and Pradeep Lall Printed Wiring Board Design and Fabrication, Denise Burkus Harris and Pradeep Lall Electronic Assemblies, Denise Burkus Harris Interconnections and Connectors, Pradeep Lall and Michael Pecht Layout, Michael D. Osterman and Michael Pecht Thermal Design Analysis, Dennis K. Karr, David Dancer, and Milton Palmes, III Thermomechanical Analysis and Design, Abhijit Dasgupta Vibration and Shock Analysis and Design, Donald B. Barker Humidity and Corrosion Analysis and Design, Wing C. Ko and Michael Pecht Design for Reliability, Michael Pecht Electronic Materials and Properties, Jillian Y. Evans and John W. Evans Appendix A: Acronyms Used in Electronics Appendix B: Glossary of Hybrid Microcircuits Packaging Terms Appendix C: Standards and Specifications for Microelectronics Appendix D: Standards and Specifications for PCBs and PWBs Appendix E: Unit Conversion Tables "
