Buch, Englisch, 120 Seiten, Format (B × H): 161 mm x 240 mm, Gewicht: 355 g
Reihe: Electronic Packaging
Buch, Englisch, 120 Seiten, Format (B × H): 161 mm x 240 mm, Gewicht: 355 g
Reihe: Electronic Packaging
ISBN: 978-0-8493-9625-0
Verlag: CRC Press
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:
- interconnections
- printed circuit boards
- substrates
- encapsulants
- dielectrics
- die attach materials
- electrical contacts
- thermal materials
- solders
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Autoren/Hrsg.
Weitere Infos & Material
Introduction,Properties of Electronics Packaging Materials,Electrical Properties,Thermal and Thermomechanical Properties,Mechanical Properties,Chemical Properties,Miscellaneous Properties,Zeroth-Level Packaging Materials,Semiconductors,Attachment Materials,Substrates,First-Level Packaging Materials,Wire Interconnects,Tape Interconnects,Case Materials,Lid Seals,Leads,Second-Level Packaging Materials,Reinforcement Fiber Materials,Resins,Laminates,Constraining Cores,Flexible Wiring Board Materials,Conductor Metals in Laminates,Conformal Coatings,Third-Level Packaging Materials,Backpanel Materials,Connectors Materials,Cables and Flex Circuit Materials,Summary,Appendices,Index
