Buch, Englisch, 584 Seiten, Format (B × H): 183 mm x 260 mm, Gewicht: 1282 g
Buch, Englisch, 584 Seiten, Format (B × H): 183 mm x 260 mm, Gewicht: 1282 g
ISBN: 978-1-4987-7947-0
Verlag: CRC Press
Optical Inspection of Microsystems, Second Edition, extends and updates the first comprehensive survey of the most important optical measurement techniques to be successfully used for the inspection of microsystems. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image processing, image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moire techniques, interference microscopy, laser-Doppler vibrometry, digital holography, speckle metrology, spectroscopy, and sensor fusion technologies. They also examine modern approaches to data acquisition and processing, such as the determination of surface features and the estimation of uncertainty of measurement results. The book emphasizes the evaluation of various system properties and considers encapsulated components to increase quality and reliability. Numerous practical examples and illustrations of optical testing reinforce the concepts.
Supplying effective tools for increased quality and reliability, this book
- Provides a comprehensive, up-to-date overview of optical techniques for the measurement and inspection of microsystems
- Discusses image correlation, displacement and strain measurement, electro-optic holography, and speckle metrology techniques
- Offers numerous practical examples and illustrations
- Includes calibration of optical measurement systems for the inspection of MEMS
- Presents the characterization of dynamics of MEMS
Zielgruppe
Academic and Professional Practice & Development
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
1. Image Processing and Computer Vision for MEMS Testing 2. Surface Features 3. A Metrological Characteristics Approach to Uncertainty in Surface Metrology 4. Image Correlation Techniques for Microsystems Inspection 5. Light Scattering Techniques for the Inspection of Microcomponents and Structures 6. Characterization and Measurement of Microcomponents with the Atomic Force Microscope (AFM) 7. Optical Profiling Techniques for MEMS Measurement 8. Grid and Moiré Methods for Micromeasurements 9. Grating (Moiré) Interferometry for In-Plane Displacement and Strain Measurement of Microcomponents 10. Interference Microscopy Techniques for Microsystem Characterization 11. Measuring MEMS in Motion by Laser Doppler Vibrometry 12. An Interferometric Platform for Static, Quasi-Static, and Dynamic Evaluation of Out-of-Plane Deformations of MEMS and MOEMS 13. Optoelectronic Holography for Testing Electronic Packaging and MEMS 14. Digital Holography and Its Application in MEMS/MOEMS Inspection 15. Speckle Metrology for Microsystem Inspection 16. Spectroscopic Techniques for MEMS Inspection 17. Sensor Fusion in Multiscale Inspection Systems