Oliver Chemical-Mechanical Planarization of Semiconductor Materials
Erscheinungsjahr 2013
ISBN: 978-3-662-06234-0
Verlag: Springer
Format: PDF
Kopierschutz: 1 - PDF Watermark
E-Book, Englisch, 428 Seiten, Web PDF
Reihe: Springer Series in Materials Science
ISBN: 978-3-662-06234-0
Verlag: Springer
Format: PDF
Kopierschutz: 1 - PDF Watermark
Chemical Mechanical Planarization (CMP) is fast becoming the established technology for removing unwanted materials after etching from the semiconductor chip surface, as well as for other steps in the manufacturing process. This volume is a comprehensive review of CMP technology in state-of-the-art semiconductor manufacturing. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered, as are polishing tools and consumables. The leading edge issues of damascene and new dielectrics as well as slurryless technology are also developed.
Zielgruppe
Professional/practitioner
Autoren/Hrsg.
Weitere Infos & Material
1 Introduction.- 2 CMP Technology.- 3 Metal Polishing Processes.- 4 Metal CMP Science.- 5 Equipment Used in CMP Processes.- 6 CMP Polishing Pads.- 7 Fundamentals of CMP Slurry.- 8 CMP Cleaning.- 9 Patterned Wafer Effects.- 10 Integration Issues of CMP.- Appendix: Pourbaix Diagrams.- References.
