SOLUTIONS MANUAL TO ACCOMPANY

Erscheinungsjahr 2000
ISBN: 978-0-12-524998-0
Verlag: William Andrew Publishing

Buch, Englisch, 160 Seiten, Format (B × H): 210 mm x 280 mm, Gewicht: 386 g

Solutions Manual to Accompany Engineering Materials Science provides information pertinent to the fundamental aspects of materials science. This book presents a compilation of solutions to a variety of problems or issues in engineering materials science.

Organized into 15 chapters, this book begins with an overview of the approximate added value in a contact lens manufactured from a polymer. This text then examines several problems based on the electron energy levels for various elements. Other chapters explain why the lattice constants of materials can be determined with extraordinary precision by X-ray diffraction, but with constantly less precision and accuracy using electron diffraction techniques. This book discusses as well the formula for the condensation reaction between urea and formaldehyde to produce thermosetting urea-formaldehyde. The final chapter deals with the similarities between electrically and mechanically functional materials with regard to reliability issues.

This book is a valuable resource for engineers, students, and research workers.

Autoren/Hrsg.

Ohring, Milton

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde

Inhaltsverzeichnis

Chapter 1

Chapter 2

Chapter 3

Chapter 4

Chapter 5

Chapter 6

Chapter 7

Chapter 8

Chapter 9

Chapter 10

Chapter 11

Chapter 12

Chapter 13

Chapter 14

Chapter 15

Über Autor(innen)

Ohring, Milton
Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.