Buch, Englisch, 232 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 376 g
Reihe: Microtechnology and MEMS
Degradation Behavior and Damage Mechanisms
Buch, Englisch, 232 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 376 g
Reihe: Microtechnology and MEMS
ISBN: 978-3-642-06152-3
Verlag: Springer
As the deep-ultraviolet (DUV) laser technology continues to mature, an increasing number of industrial and manufacturing applications are emerging. For example, the new generation of semiconductor inspection systems is being pushed to image at increasingly shorter DUV wavelengths to facilitate inspection of deep sub-micron features in integrated circuits. DUV-sensitive charge-coupled device (CCD) cameras are in demand for these applications. Although CCD cameras that are responsive at DUV wavelengths are now available, their long-term stability is still a major concern. This book describes the degradation mechanisms and long-term performance of CCDs in the DUV, along with new results of device performance at these wavelengths.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Sonstige Technologien | Angewandte Technik Signalverarbeitung, Bildverarbeitung, Scanning
- Mathematik | Informatik EDV | Informatik Informatik Bildsignalverarbeitung
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Sensorik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
Weitere Infos & Material
Overview of CCD.- CCD Imaging in the Ultraviolet (UV) Regime.- Silicon.- Silicon Dioxide.- Si-SiO2 Interface.- General Effects of Radiation.- Effects of Radiation on CCDs.- UV-Induced Effects in Si.- UV Laser Induced Effects in SiO2.- UV Laser Induced Effects at the Si-SiO2 Interface.- CCD Measurements at 157nm.- Design Optimizations for Future Research.- Concluding Remarks.