Moschytz / Helfenstein | Circuits and Systems for Wireless Communications | Buch | 978-0-7923-7722-1 | sack.de

Buch, Englisch, 388 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 1650 g

Moschytz / Helfenstein

Circuits and Systems for Wireless Communications


2002
ISBN: 978-0-7923-7722-1
Verlag: Springer US

Buch, Englisch, 388 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 1650 g

ISBN: 978-0-7923-7722-1
Verlag: Springer US


Thisbook contains revised contributions byt he speakers oft he 1s t IEEE Workshop on Wireless Communication Circuits andSystems, held in Lucerne, Switzerland, from June 22–24, 1998. The aim oft he workshop was to apply the vast expertise oft he CAS Society in the area of circuit and systemdesign to therapidly growing field of wireless communications. Theworkshop combined presentations by invited experts from academia and industry with panel and informal discussions. The following topics were covered: RFSystemInteg ration (single chip systems, CM OS RF circuits), RFFront End Circuits (CMOS RF oscillators, broadband design techniques), Wideband Conversion for Software Radio (A/D conversion issues, wideband sub sampling, low spurious A/D conversion), Process Technologies for Future RF Systems (Si, SiGe, GaAs, CMOS, packaging technologies), DSPforWireless Communications (DSP algorithms, fixed point systems, DSP for baseband applications), Blind Channel Equalization (adaptive interference suppression, design techniques, channel estimation). The workshop was a great success, with over 130 participants from 19 countries, from the U. S. to Europe and Asia, including a large contingent of participants from industry (60% ). Feedback from the participants showed that the carefully selected combination oftutorial like lectures with lectures onspecialized and advancedtopics was a feature oft he workshop that was particularly a ppreciated. Duet o therelatively strong involvemento findustry — both in theform of lecturers and listeners — a high level ofd i scussion was attained in bothpanel sessions and informal gatherings.

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Weitere Infos & Material


RF System Integration.- RF System Board Level Integration for Mobile Phones.- Integration of RF Systems on a Chip.- Towards the Full Integration of Wireless Front-End Circuits in Deep-Submicron Technologies.- GSM Transceiver Front-End Circuits in 0.25 ?m CMOS.- RF Front-End Circuits.- Phase-Noise-to-Carrier Ratio in LC Oscillators.- Design Study of a 900 MHz/1.8 GHz CMOS Transceiver for Dual-Band Applications.- Integrated Wireless Transceiver Design with Emphasis on if Sampling.- Transmitter Concepts, Integration and Design Trade-Offs.- RF Challenges for Tomorrow’s Wireless Terminals.- Wide Band Conversion for Software Radio.- Wide-Band Sub-Sampling A/D Conversion with Image Rejection.- Wide-Band A/D Conversion for Base Stations.- Low-Spurious ADC Architectures for Software Radio.- Process Technologies for Future RF Sytsems.- Low-Cost Si and Si/Si1?xGex Heterostructure BiCMOS Technologies for Wireless Applications.- GaAs-Based RFIC Technology for Consumer Radios.- Monolithic Integrated Transceiver Circuits for GHZ Freqiencies.- DSP for Wireless Communications.- Efficient Design Flow for Fixed-Point Systems.- R.E.A.L. DSP: Reconfigurable Embedded DSP Architecture for Low-Power/Low-Cost Telecom Baseband Processing.- Dedicated VLSI Architectures for Adaptive Interference Suppression in Wireless Communication Systems.- Evolution of Speech Coding for Wireless Communications.- Digital Signal Processing and Digital Signal Processors for Mobile Communications: Basic Concepts and Trends.- Blind Channel Equalization.- Adaptive Interference Suppression for Wireless Multiple-Access Communication Systems.- Channel Estimation and Equalization in Wireless ATM.- Blind Separation and Combination of High-Rate Digital QAM Radio Signals.



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