5G NR, Wi-Fi 6, and Bluetooth LE 5

A Primer on Smartphone Wireless Technologies
2023
ISBN: 978-3-031-33814-4
Verlag: Springer

Buch, Englisch, 182 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 306 g

This book provides, at a high level and in a tractable fashion, a description of how wireless communications are achieved in the latest smartphones. The author shows how smartphones communicate via three separate systems, namely 5G NR, Wi-Fi 6, and Bluetooth Low Energy 5. He explains how 5G NR allows mobile voice and high-speed data communication, how Wi-Fi allows smartphone attachment to the Internet independent of 5G NR, and how Bluetooth allows smartphone attachment to speakers, in-car entertainment systems, smart watches, etc. This text explains the key basic technologies employed and then addresses how each system operates. This book is of interest to anyone with a rudimentary scientific understanding who desires to know more at an intuitive level rather than rigorous one how smartphones achieve wireless communications. 

Zielgruppe

Professional/practitioner

Autoren/Hrsg.

Morais, Douglas H

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Nachrichten- und Kommunikationstechnik Drahtlostechnologie
• Mathematik | Informatik EDV | Informatik Informatik Mensch-Maschine-Interaktion Ambient Intelligence, RFID, Internet der Dinge
• Technische Wissenschaften Energietechnik | Elektrotechnik Elektrotechnik

Inhaltsverzeichnis

Chapter 1 5G Nr, Wi-Fi 6, and Bluetooth LE 5 Introduction.- Chapter 2 Data Communications Systems Protocol Stacks.- Chapter 3 The Wireless Path.- Chapter 4 Digital Modulation: The Basic Principles.- Chapter 5 Channel Coding and Link Adaptation.- Chapter 6 Channel Usage Techniques.- Chapter 7 Multiple Antenna Techniques.- Chapter 8 5G NR Overview.- Chapter 9 Wi-Fi 6 Overview.- Chapter 10 Bluetooth LE Overview.

Über Autor(innen)

Dr. Douglas H. Morais received a Ph.D from University of Ottawa, Canada, an M.Sc from the University of California, Berkeley, California, and a B.Sc from the University of Edinburgh, Scotland, all in Electrical Engineering. Additionally, he is a Graduate of the AEA/Stanford Executive Institute, Stanford University, California, a Life Senior member of the IEEE Communications Society, and a member of the IEEE Communications Society. After decades in the industry, he is currently a technical book author, short course lecturer, and inventor. Previously, he was President of the Wireless Group at Ortel Corporation and both Executive Vice President, Business Development and Technology and President, Wireless Products Group at California Microwave, Inc. He is the author of “Fixed Broadband Wireless Communications,” Pearson Education, Inc., 2004, “5G and Beyond Wireless Transport Technologies,” Springer, 2021, and “Key 5G Physical Layer Technologies, Second Edition” Springer, 2022. He has three US patents, including two on digital modulation and one on point-to-multipoint communication.