E-Book, Englisch, 398 Seiten
E-Book, Englisch, 398 Seiten
ISBN: 978-3-03813-025-3
Verlag: Trans Tech Publications
Format: PDF
Kopierschutz: 0 - No protection
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Preface, Committees
1. SURFACE PREPARATION FOR GATE DIELECTRIC WITH HIGH DIELECTRIC CONSTANT
High-k Gate Dielectrics on Silicon and Germanium: Impact of Surface Preparation
UV Activated Surface Preparation of Silicon for High-k Dielectric Deposition
Enhanced Surface Preparation Techniques for the Si/High-k Interface
Uniform Ultrathin Oxide Growth for High-k Preclean
On the Application of a Thin Ozone Based Wet Chemical Oxide as an Interface for ALD High-k Deposition
Interface State Densities and Surface Charge on Wet-Chemically Prepared Si(100) Surfaces
A Study of the Influence of Typical Wet Chemical Treatments on the Germanium Wafer Surface
Surface Preparation Techniques for High-k Deposition on Ge Substrates
2. FRONT-END-OF-LINE CLEANING, RINSE AND DRYING
Advanced Surface Cleaning Strategy for 65nm CMOS Device Performance Enhancement
Process, Environmental & Economical Considerations to Implement Single Wafer Cleaning Tools in 300mm Wafer Fabs
In Situ Wafer Processing for Next Generation Devices
Organic Contamination Control in Silicon Surface Processing
Application of UV/VIS-Spectroscopy for Determination of Complexing Agent Stability in APM and Like Mixtures Thereof
Plasma Cleaning for W Polymetal Gate
Development of New Batch-Type Plasma Assisted NOR (Native-Oxide-Removal) Dry Cleaning Equipment
Evaluation of Wafer Drying Methods for GIGA-LEVEL Device Fabrication
Surfactionated Rinse against Pattern Collapse and Defectivity in 193nm Lithography
Performance of a Linear Single Wafer IPA Vapour Based Drying System
Effective Rinse Aiming at Water-Mark-Free Drying for Single-Spin Wet Cleaning Process
Insights into Watermark Formation and Control
Occurrence of Arsenic-Based Defects and Techniques for Their Elimination
3. WET AND GASEOUS ETCHING
Selective Wet Removal of Hf-Based Layers and Post-Dry Etch Residues in High-k and Metal Gate Stacks
HF Based Solutions for HfO2 Removal; Effect of pH and Temperature on HfO2: SiO2 Etch Selectivity
Selective Si3N4 Etch in Single Wafer Application
Etch Rate Depth Profiling by Single Wafer Etching Equipment
Novel Chemical Etching to Correct Film Thickness Distributions
Etching of Silicon Oxide Films in Supercritical Carbon Dioxide
4. PARTICLES: CHALLENGE AND CLEANING METHODS
Challenges of Finer Particle Detection on Bulk-Silicon and SOI Wafers
The Impact of Backside Particles on the Limits of Optical Lithography
Inspection Challenges at the 45nm Technology Node
Metrology and Removal of Nanoparticles from 500 Micron Deep Trenches
Evaluation of Megasonic Cleaning for Sub-90nm Technologies
Strength Distribution of Megasonic Damage Events
Using Megasonics for Particle and Residue Removal in Single Wafer Cleaning
Behaviour of a Well-Designed Megasonic Cleaning System
Megasonics: A Cavitation Driven Process
Electrophoretic Studies on Silicon Nitride: Traces of Silicates in UPW Shift Zeta Potential Similar to SC-1
Damage-Free Cleaning of Sub-50 nm Devices Using Directed Megasonics Technology in a Single Wafer Processor
A Comparison of Particle Filtration in a Recirculated Wet Bench Wet Cleaning Tool: Performance of PTFE Filters and of Surface Optimized Filters
5. PARTICLES: ALTERNATIVE CLEANING METHODS
Influences of Oxide Loss on Contamination Removal
Non-Damaging Particle Removal Using Cryogenic Aerosols
Laser Cleaning of Particles from Silicon Wafers: Capabilities and Mechanisms
Contaminants Removal from Epi Substrates Using Vapor-Laser Process
Chemical Additive Formulations for Particle Removal in SCCO2-Based Cleaning
Non-Damaging CO2 Aerosol Cleaning in FEOL IC Manufacturing
Particle Adhesion on Tool Kit Part: Case Study for Ceramic Material
6. METROLOGY
Simultaneous Analysis of Light and Heavy Organic Contamination on Silicon Wafer
VPD-DC-TXRF for Metallic Contamination Analysis of Ge Wafers
Cu Spin Cleaning Evaluation by SOR X-Ray Fluorescence Analysis
Application of HPLC for the Analysis of Organic Additives in Cleaning Chemicals and Cleaning Mixtures
7. CONTAMINATION CONTROL
Chromium Contamination in Silicon: Detection and Impact on Oxide Performances
Further Reduction of Trace Level Ion from Ultra Pure Water and Its Effect on Electrical Property of Device
Prevention of Copper Cross-Contamination on Cu Process and Non-Cu Process Mixed Fabrication
Wafer Backside Cleaning Strategies for High-k/Metal Gate Processing
Direct Mixing Cleaning Method of Aqua Regia on Wafer
Single Backside Cleaning on Silicon, Silicon Nitride and Silicon Oxide
The Degradation Prevention of Resin Materials for Semiconductor Manufacturing Equipment by Applying the Ultra-High Purity Gas Supply Technology
Measurement and Control of Airborne Molecular Contamination during Wafer Storage and Transport
Purification of Trace Amount of Metal Impurity from Ultra Pure Water Using Membrane Purifier/Filter
Metal Contamination on Silicon Surfaces from Solvents
8. POST CMP CLEANING
Adhesion and Removal of Alumina Slurry Particles on Wafer Surfaces in Cu CMP
A Force Study in Brush Scrubbing
Dissolution Characteristics of Ceria in Ascorbic Acid Solutions with Implications to Cleaning
Investigation of Dissolution and Electrodeposition of Copper in Concentrated and Diluted Oxalic Acid Media in Post-CMP Cleaning
Non-Contact Cleaning Process for Post-CMP Copper
9. WET PHOTO RESIST REMOVAL
Novel Photo Resist Stripping for Single Wafer Process
Resist Stripping for Advanced FEOL Nodes: Improvements to Process Based on Ozone Diffusion by Use of Additives
Cleaning Capability of High Concentration Ozonated Water
Photoresist Stripping by Ozone/Water Processes: Effect of Additives
10. BACK-END-OF-LINE CLEANING
Supercritical CO2 Applications in BEOL Cleaning
Repair of Porous MSQ (p-MSQ) Films Using Monochlorosilanes Dissolved in Supercritical CO2
Copper Decontamination Ability of Supercritical-CO2/Additives on CVD and Spin-On Porous MSQ Materials
Angled XPS Analysis of Low-k Dielectric Surfaces after Cleaning
Impact of Downstream Ash Plasmas on Ultra Low-k Materials
Activated He:H2 Strip of Photoresist over Porous Low-k Materials
Qualification of Resist Strip Process for Ultra Low-k/Cu Interconnect
Effect of Chemical Solution on the Stability of Low-k Films
Aqueous Based Single Wafer Cu/Low-k Cleaning Process Characterization and Integration into Dual Damascene Process Flow
Via Cleaning Technology for Post Etch Residues
Barrier and Copper Seedlayer Wet Etching
Deposition Behavior of Volatile Acidic Contaminants on Metallic Interconnect Surfaces
Effects of Patterns on Corrosion in Cu CMP
Advanced Aqueous Cleaner II: PER Removal from Sensitive Cu/Low-k Devices
Advanced Aqueous Cleaner I, Dilute Solutions for the Selective Removal of Post Etch Residues in the Presence of Aluminium
New Post Etch Polymer Removal Process for Al-Interconnects and Vias in Tank and Spray Tools Using a New Inorganic Chemistry
Effective Polymer Removal: Process Window-Process Uniformity-Extended Chemical Bath-Life
