Flexible Electronic Packaging and Encapsulation Technology

1. Auflage 2024
ISBN: 978-3-527-35359-0
Verlag: Wiley-VCH GmbH

Buch, Englisch, 384 Seiten, Format (B × H): 170 mm x 245 mm, Gewicht: 884 g

Flexible Electronic Packaging and Encapsulation Technology

A systematic introduction to the future of electronic packaging

Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential.

Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems.

Flexible Electronic Packaging and Encapsulation Technology readers will also find: - Survey of commercial electronic packaging materials and patents for reference purposes
- Guidelines for designing high-performance packaging materials with novel structures
- An authorial team of leading researchers in the field

Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.

Autoren/Hrsg.

Meng, Hong

Huang, Wei

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
• Naturwissenschaften Physik Elektromagnetismus Halbleiter- und Supraleiterphysik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise

Inhaltsverzeichnis

1 OVERVIEW OF FLEXIBLE ELECTRONIC ENCAPSULATING TECHNOLOGY
1.1 Flexible electronics overview
1.2 Development of flexible electronic encapsulating technology
1.3 Encapsulating technology of several important flexible electronic devices
1.4 Flexible electronic encapsulating materials
1.5 Overview of the development of flexible electronic packaging at home and abroad
 
2 BASIC CONCEPTS RELATED TO FLEXIBLE ELECTRONIC PACKAGING
2.1 Composition of Flexible Electronic Packaging
2.2 Flexible Electronic Packaging Structure
2.3 Encapsulation Principle
2.4 Packaging Technology
2.5 Packaging Stability
2.6 Encapsulated Products
2.7 Chapter Summary
 
3 FLEXIBLE SUBSTRATES
3.1 Concept and connotation of flexible substrates
3.2 Development history of flexible substrates
3.3 Flexible substrate materials
3.4 Molding technology of flexible substrate
3.5 Performance evaluation of flexible substrates
3.6 Application of flexible substrates
3.7 Development trend of flexible substrates
 
4 TEST METHODS
4.1 Sealing test
4.2 Bending test
4.3 Mechanical performance testing
4.4 Stability testing
 
5 FLEXIBLE ELECTRONIC ENCAPSULATION
5.1 Inorganic encapsulating material
5.2 Organic encapsulating material
5.3 Organic-inorganic hybrid encapsulating material
 
6 DEVELOPMENT OF FLEXIBLE ELECTRONICS PACKAGING TECHNOLOGY
6.1 Flexible Electronics Packaging
6.2 Thin Film Packaging Technology
 
7 APPLICATION OF FLEXIBLE ELECTRONICS PACKAGING
7.1 Industry chain analysis of flexible electronics packaging
7.2 Packaging applications of flexible OLED devices
7.3 Packaging applications for flexible solar cells
7.4 Packaging applications for flexible electronic devices
7.5 Packaging applications for flexible electronics sensors
 
8 TESTING STANDARDS
8.1 Terminology and alphabetic symbols
8.2 Mechanical test method (deformation test)
8.3 Environmental test methods
8.4 Mechanical test methods (impact and hardness tests)
 
9 ANALYSIS OF FLEXIBLE ELECTRONIC PACKAGING ENTERPRISE
9.1 Flexible Electronic Packaging Enterprise
9.2 Analysis of Flexible Electronic Packaging Enterprises
 
10 FLEXIBLE ELECTRONICS PACKAGING DEVELOPMENT TRENDS
10.1 Flexible electronics packaging trends overview
10.2 Introduction of three packaging technologies for flexible electronic devices
10.3 Flexible electronics packaging development trend summary
 

 

Über Autor(innen)

Prof. Hong Meng received his Ph.D. from University of California Los Angeles (UCLA) in 2002. He has been working in the field of organic electronics for more than 30 years. His career experiences including working at the Institute of Materials Science and Engineering (IMRE) in Singapore, Lucent Technologies Bell Labs, DuPont Experimental Station. In 2014, he moved to School of Advanced Materials at Peking University Shenzhen Graduate School. He has contributed over 230 peer-reviewed papers (citation: 11000) in chemistry and materials science fields, filed over 46 US patents, 140 Chinese patents.
Professor Wei Huang obtained his BSc, MSc and PhD from the Department of Chemistry, Peking University in 1983, 1988, and 1992, respectively. After teaching Physical Chemistry in Peking University from 1992 to 1993, he began his postdoctoral research with National University of Singapore (NUS) since 1995. In November 2011, he was elected as Academician of the Chinese Academy of Sciences (CAS). In April 2017, he was appointed as Deputy President & Provost of Northwestern Polytechnical University, China.