Buch, Englisch, 162 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 277 g
Reihe: The Springer International Series in Engineering and Computer Science
Buch, Englisch, 162 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 277 g
Reihe: The Springer International Series in Engineering and Computer Science
ISBN: 978-1-4419-5282-0
Verlag: Springer US
This book describes techniques that can reduce mechanical-stress-induced inaccuracy and long-term instability in chips. The authors also show that the piezojunction effect can be applied for new types of mechanical-sensor structures. Thermo-mechanical stress is induced when packaged chips cool down to the temperature of application.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Verbundwerkstoffe
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
Weitere Infos & Material
Mechanical stress in integrated circuits.- Piezo effects in silicon.- Characterization of the piezojunction effect.- Minimizing the piezojunction and piezoresistive effects in integrated devices.- Minimizing the inaccuracy in packaged integrated circuits.- Stress-sensing elements based on the piezojunction effect.- Conclusions.
