E-Book, Englisch, 428 Seiten, E-Book
Reihe: IEEE Press
May / Spanos Fundamentals of Semiconductor Manufacturing and Process Control
1. Auflage 2006
ISBN: 978-0-471-79027-3
Verlag: John Wiley & Sons
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)
E-Book, Englisch, 428 Seiten, E-Book
Reihe: IEEE Press
ISBN: 978-0-471-79027-3
Verlag: John Wiley & Sons
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)
A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design
Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts.
Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields.
The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis.
Critical coverage includes the following:
* Combines process control and semiconductor manufacturing
* Unique treatment of system and software technology and managementof overall manufacturing systems
* Chapters include case studies, sample problems, and suggestedexercises
* Instructor support includes electronic copies of the figures andan instructor's manual
Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment.
An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment.
An Instructor Support FTP site is also available.
Autoren/Hrsg.
Weitere Infos & Material
Preface.
Acknowledgments.
1. Introduction to Semiconductor Manufacturing.
Objectives.
Introduction.
1.1. Historical Evolution.
1.2. Modern Semiconductor Manufacturing.
1.3. Goals of Manufacturing.
1.4. Manufacturing Systems.
1.5. Outline for Remainder of the Book.
Summary.
Problems.
References.
2. Technology Overview.
Objectives.
Introduction.
2.1. Unit Processes.
2.2. Process Integration.
Summary.
Problems.
References.
3. Process Monitoring.
Objectives.
Introduction.
3.1. Process Flow and Key Measurement Points.
3.2. Wafer State Measurements.
3.3. Equipment State Measurements.
Summary.
Problems.
References.
4. Statistical Fundamentals.
Objectives.
Introduction.
4.1. Probability Distributions.
4.2. Sampling from a Normal Distribution.
4.3. Estimation
4.4. Hypothesis Testing.
Summary.
Problems.
Reference.
5. Yield Modeling.
Objectives.
Introduction.
5.1. Definitions of Yield Components.
5.2. Functional Yield Models.
5.3. Functional Yield Model Components.
5.4. Parametric Yield.
5.5. Yield Simulation.
5.6. Design Centering.
5.7. Process Introduction and Time-to-Yield.
Summary.
Problems.
References.
6. Statistical Process Control.
Objectives.
Introduction.
6.1. Control Chart Basics.
6.2. Patterns in Control Charts.
6.3. Control Charts for Attributes.
6.4. Control Charts for Variables.
6.5. Multivariate Control.
6.6. SPC with Correlated Process Data.
Summary.
Problems.
References.
7. Statistical Experimental Design.
Objectives.
Introduction.
7.1. Comparing Distributions.
7.2. Analysis of Variance.
7.3. Factorial Designs.
7.4. Taguchi Method.
Summary.
Problems.
References.
8. Process Modeling.
Objectives.
Introduction.
8.1. Regression Modeling.
8.2. Response Surface Methods.
8.3. Evolutionary Operation.
8.4. Principal-Component Analysis.
8.5. Intelligent Modeling Techniques.
8.6. Process Optimization.
Summary.
Problems.
References.
9. Advanced Process Control.
Objectives.
Introduction.
9.1. Run-by-Run Control with Constant Term Adaptation.
9.2. Multivariate Control with Complete Model Adaptation.
9.3. Supervisory Control.
Summary.
Problems.
References.
10. Process and Equipment Diagnosis.
Objectives.
Introduction.
10.1. Algorithmic Methods.
10.2. Expert Systems.
10.3. Neural Network Approaches.
10.4. Hybrid Methods.
Summary.
Problems.
References.
Appendix A: Some Properties of the Error Function.
Appendix B: Cumulative Standard Normal Distribution.
Appendix C: Percentage Points of the chi2Distribution.
Appendix D: Percentage Points of the tDistribution.
Appendix E: Percentage Points of the FDistribution.
Appendix F: Factors for Constructing Variables ControlCharts.
Index.