Buch, Englisch, 508 Seiten, Format (B × H): 160 mm x 231 mm, Gewicht: 798 g
Buch, Englisch, 508 Seiten, Format (B × H): 160 mm x 231 mm, Gewicht: 798 g
Reihe: Manufacturing Engineering and Materials Processing
ISBN: 978-1-57444-670-8
Verlag: Taylor & Francis Inc
Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to bring to the light of day the physical fundamentals and advanced technologies at the leading edge of modern lapping and polishing practice.
Collecting decisive work contributed by industrial and academic experts from the USA, Germany, and Japan, this authoritative resource presents the latest lapping and polishing technologies along with case studies that illustrate their value. After a brief introduction, the book explains the fundamental concepts and major types of lapping and polishing processes. The discussion then turns to lapping of ductile and brittle materials followed by an in-depth look at lapping machines and equipment. Rounding out the presentation, the final chapters discuss polishing technologies and equipment as well as the latest on chemical-mechanical polishing (CMP) and its applications in the semiconductor industry.
Offering an integrated approach to both theory and practical applications under a single cover, the Handbook of Lapping and Polishing supplies a definitive survey of the most advanced surface finishing technologies available.
Marinescu / Uhlmann / Doi
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Collecting decisive work contributed by industrial and academic experts from the USA, Germany, and Japan, this authoritative resource presents the latest lapping and polishing technologies along with case studies that illustrate their value. After a brief introduction, the book explains the fundamental concepts and major types of lapping and polishing processes. The discussion then turns to lapping of ductile and brittle materials followed by an in-depth look at lapping machines and equipment. Rounding out the presentation, the final chapters discuss polishing technologies and equipment as well as the latest on chemical-mechanical polishing (CMP) and its applications in the semiconductor industry.
Offering an integrated approach to both theory and practical applications under a single cover, the Handbook of Lapping and Polishing supplies a definitive survey of the most advanced surface finishing technologies available.
Zielgruppe
Professional
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Introduction. Fundamentals of Lapping. Lapping of Ductile Materials. Lapping of Brittle Materials. Lapping and Lapping Machines. Polishing Technology. Chemical Mechanical Polishing and Its Applications. Index.
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