Buch, Englisch, 526 Seiten, Format (B × H): 163 mm x 237 mm, Gewicht: 2070 g
ISBN: 978-0-442-01206-9
Verlag: Springer Us
Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Mathematik | Informatik EDV | Informatik Technische Informatik Hochleistungsrechnen, Supercomputer
- Mathematik | Informatik EDV | Informatik Daten / Datenbanken Zeichen- und Zahlendarstellungen
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Werkzeugbau
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
Weitere Infos & Material
Design for good soldering and cleaning; Storage, kitting, assembly and presolder operations; Soldering and cleaning materials; The wave soldering process and the equipment; Surface mount technology; Solder paste technology; Reflow soldering for surface mounting; Cleaning materials, processes, and equipment; Trouble-shooting the printed circuit; Quality and inspection; Touch-up and repair; Process economy and managing the line; Index.
