Buch, Englisch, Band 500, 257 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 417 g
Reihe: IFIP Advances in Information and Communication Technology
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
1. Auflage 2019
ISBN: 978-3-030-15665-7
Verlag: Springer International Publishing
25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers
Buch, Englisch, Band 500, 257 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 417 g
Reihe: IFIP Advances in Information and Communication Technology
ISBN: 978-3-030-15665-7
Verlag: Springer International Publishing
The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.
Zielgruppe
Research