Thermal Contact Conductance

Softcover Nachdruck of the original 2. Auflage 2014
ISBN: 978-3-319-37428-4
Verlag: Springer International Publishing

Buch, Englisch, 260 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 4277 g

Reihe: Mechanical Engineering Series

The work covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. All of the material has been updated to reflect the latest advances in the field.

Zielgruppe

Professional/practitioner

Autoren/Hrsg.

Madhusudana, Chakravarti V.

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Technische Thermodynamik
• Naturwissenschaften Physik Angewandte Physik
• Naturwissenschaften Physik Thermodynamik

Inhaltsverzeichnis

Introduction.- Thermal Constriction Resistance.- Solid Spot Thermal Conductance of a Joint.- Gap Conductance at the Interface.-Experimental Aspects.- Special Configurations and Processes.- Control of Thermal Contact Conductance Using Interstitial Materials and Coatings.- Major Applications.- Additional Topics.- Concluding Remarks.

Über Autor(innen)

Professor Madhusudana is currently working out of Sudney, Australia