E-Book, Englisch, 402 Seiten
Reihe: Micro- and Opto-Electronic Materials, Structures, and Systems
Liu / Zhao / Xiong Packaging of High Power Semiconductor Lasers
2015
ISBN: 978-1-4614-9263-4
Verlag: Springer
Format: PDF
Kopierschutz: 1 - PDF Watermark
E-Book, Englisch, 402 Seiten
Reihe: Micro- and Opto-Electronic Materials, Structures, and Systems
ISBN: 978-1-4614-9263-4
Verlag: Springer
Format: PDF
Kopierschutz: 1 - PDF Watermark
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi'an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.




